Electromagnetic interference shielding materials, devices, and methods of manufacture thereof

ABSTRACT

Described are electromagnetic shields comprising a substrate, a conductive additive, and a binder incorporated with the conductive additive and deposited on the substrate, and methods of making thereof.

CROSS-REFERENCE

This application claims the benefit of U.S. Provisional Application No.62/957,030, filed Jan. 3, 2020, and U.S. Provisional Application No.62/957,035, filed Jan. 3, 2020, which are hereby incorporated byreference in their entirety herein.

BACKGROUND

Electromagnetic interference (EMI) is a signal received from a naturalor man-made external source that is unwanted. Such EMI can andnegatively affect the performance of electrical component throughelectromagnetic induction, electrostatic coupling, or conductionprovided thereby. These electronic disturbances can degrade theperformance of computing and communication components by increasing theerror rates in data transfer and storage. EMI shielding, however, canprotect electrical devices from external signal interference, fromleaking EMI signals, and to prevent electrical components within anelectrical device from interfering with each other. Shielding from EMIis also important to ensure accurate testing and calibration ofelectronic components.

EMI shields are typically composed of metals or metal composites, due totheir high conductivity. However, such metallic components can bedifficult to manufacture and are susceptible to chemical corrosions andoxidations, which reduce the shielding effectiveness over time.

SUMMARY

Disclosed herein are electromagnetic shields or shielding materials thatprovide numerous advantages over conventional EMI shields. The EMIshields can be used to efficiently dissipate heat and minimize problemsassociated with EMI interference via its superior electrical and/orthermal properties while also providing excellent mechanical flexibilityand structural integrity. Unlike conventional metal foils, the EMIshielding materials disclosed herein are mechanically strong, corrosionresistant and offer processing advantages. In addition to high thermaland electrical conductivity, the EMI shielding materials can be thin,flexible, lightweight, and corrosion resistant. It can also be easy tocut and able to withstand repeated bending in contrast to standardmetal-based EMI shielding that are more difficult to cut and can besubject to metal fatigue if subjected to repeated bending.

Disclosed herein are methods of manufacturing EMI shields or shieldingmaterials. Compared to conventional EMI shields, the EMI shieldingmaterials of the present disclosure are easier to manufacture and can beprepared at various thicknesses and sizes on different substrates toachieve the desired combination of properties. For example, a thickerand less flexible material may be prepared to allow greater EMIreduction for more sensitive electronics where flexibility is of lessimportance.

In some embodiments, the EMI shields or shielding materials areconfigured to be water resistant and/or waterproof. In some embodiments,the EMI shields or shielding materials are configured to have structuralflexibility and/or resilience. In some embodiments, the EMI shields orshielding materials are configured to be scratch resistant. For example,in some embodiments, the EMI shields or shielding materials comprisebinders or binder compositions such as carboxylated styrene acryliclatex and/or acrylic.

In one aspect, disclosed herein is an electromagnetic shield comprising:a substrate; a conductive additive; and a binder incorporated with theconductive additive and deposited on the substrate. In some embodiments,the substrate comprises a plastic, a metal, a glass, a fabric, or anycombination thereof. In some embodiments, the metal comprises copper,aluminum, steel, stainless steel, beryllium, bismuth, chromium, cobalt,gallium, gold, indium, iron, lead, magnesium, nickel, silver, titanium,tin, zinc, or any combination thereof. In some embodiments, the plasticcomprises a thermoplastic. In some embodiments, the thermoplasticcomprises polyethylene terephthalate, polyglycolic acid, polylacticacid, polycaprolactone, polyhydroxyalkanoate, polyhydroxybutyrate,polyethylene adipate, polybutylene succinate,poly(3-hydroxybutyrate-co-3-hydroxyvalerate), polybutyleneterephthalate, polytrimethylene terephthalate, polyethylene naphthalate,or any combination thereof. In some embodiments, the conductive additivecomprises a carbon-based additive. In some embodiments, the carbon-basedadditive comprises, graphite, graphene, reduced graphene, grapheneoxide, reduced graphene oxide, carbon black, cabot carbon, a carbonnanotube, a functionalized carbon nanotube, or any combination thereof.In some embodiments, the carbon-based additive is reduced. In someembodiments, the carbon-based additive is porous. In some embodiments,the carbon-based additive comprises nanoplatelets, nanofibers,nanotubes, nanoparticles, nanorods, nanowires, nanoflowers, nanoflakes,nanofibers, nanoplatelets, nanoribbons, nanocubes, bipyramids,nanodiscs, nanoplates, nanodendrites, nanoleaves, nanospheres, quantumspheres, quantum dots, nanosprings, nanosheets, or any combinationthereof. In some embodiments, the carbon nanotube is a multi-wallednanotube, a single-walled nanotube, or a combination thereof. In someembodiments, the functionalized carbon nanotube is functionalized withhydroxide, carboxylic acid, or both. In some embodiments, the carbonnanotube has an outside diameter of about 20 nm to about 60 nm. In someembodiments, the carbon nanotube has a length of about 0.25 μm to about4 μm. In some embodiments, the carbon nanotube has a specific surfacearea of greater than about 60 m2/g In some embodiments, the carbonnanotube has an electrical conductivity of greater than about 100 S/cm.In some embodiments, the carbon-based additive has a mean particle sizeof about 2 μm to about 30 μm. In some embodiments, the carbon-basedadditive has a specific surface area of about 2 m²/g to about 16 m²/g.In some embodiments, the carbon-based additive has a density of 0.5g/cm³ to about 4 g/cm³. In some embodiments, at least one of thegraphene and the graphene oxide has a specific surface area of greaterthan 1,000 m²/g. In some embodiments, at least one of the graphene andthe graphene oxide has a conductivity of about 1,000 S/m to about 4,000S/m. In some embodiments, the reduced graphene oxide comprises reducedgraphene oxide sheets having a width, length or both of about 0.3 μm toabout 10 μm. In some embodiments, the binder comprises a polymericbinder. In some embodiments, the polymeric binder comprises styrenebutadiene rubber, polyvinylidene fluoride, polytetrafluoroethylene,polyvinyl pyrrolidone, ethyl cellulose, polyurethane, polyester,carboxymethyl cellulose, polyurethane, polyester, polyvinyl alcohol, orany combination thereof. In some embodiments, the electromagnetic shieldcomprises about 2.5% to about 99% by weight of the conductive additive.In some embodiments, the electromagnetic shield has a conductivity ofabout 10 S/m to about 20,000 S/m. In some embodiments, theelectromagnetic shield has a sheet resistance of about 0.1 ohm/sq toabout 1,000 ohm/sq. In some embodiments, the electromagnetic shield hasan operating temperature of at about 0° C. to about 400° C. In someembodiments, the electromagnetic shield has a thickness of about 10 μmto about 1,000 μm. In some embodiments, the electromagnetic shield has ashielding effectiveness in the frequency range of about 10 kHz to about40 MHz of about 20 dB to about 40 dB with a film thickness of less thanabout 100 μm. In some embodiments, the electromagnetic shield has ashielding effectiveness in the frequency range of 1 GHz to 40 GHz ofabout 40 dB to about 70 dB with a film thickness of less than about 100μm. In some embodiments, the electromagnetic shield has a shieldingeffectiveness in the frequency range of about 10 kHz to about 30 kHz ofabout 5 dB to about 40 dB. In some embodiments, the electromagneticshield has a shielding effectiveness in the frequency range of about 40kHz to about 100 MHz of about 1 dB to about 100 dB. In some embodiments,the electromagnetic shield has a shielding effectiveness in thefrequency range of about 200 MHz to about 1 GHz of about 1 dB to about100 dB. In some embodiments, the electromagnetic shield has a shieldingeffectiveness in the frequency range of about 2 GHz to about 18 GHz ofabout 1 dB to about 120 dB. In some embodiments, the electromagneticshield has a shielding effectiveness in the frequency range of about 18GHz to about 40 GHz of about 1 dB to about 120 dB.

Another aspect provided herein is a method of forming an electromagneticshield, comprising: forming a coating comprising: a conductive additive;a binder; a solvent; a surfactant; and a defoamer; depositing thecoating on a substrate; and drying the coating on the substrate. In someembodiments, the conductive additive comprises a carbon-based additive.In some embodiments, the carbon-based additive comprises, graphite,graphene, reduced graphene, graphene oxide, reduced graphene oxide,carbon black, cabot carbon, a carbon nanotube, a functionalized carbonnanotube, or any combination thereof. In some embodiments, thecarbon-based additive is reduced. In some embodiments, the carbon-basedadditive is porous. In some embodiments, the carbon-based additivecomprises nanoplatelets, nanofibers, nanotubes, nanoparticles, nanorods,nanowires, nanoflowers, nanoflakes, nanofibers, nanoplatelets,nanoribbons, nanocubes, bipyramids, nanodiscs, nanoplates,nanodendrites, nanoleaves, nanospheres, quantum spheres, quantum dots,nanosprings, nanosheets, or any combination thereof. In someembodiments, the carbon nanotube is a multi-walled nanotube, asingle-walled nanotube, or a combination thereof. In some embodiments,the functionalized carbon nanotube is functionalized with hydroxide,carboxylic acid, or both. In some embodiments, the carbon nanotube hasan outside diameter of about 20 nm to about 60 nm. In some embodiments,the carbon nanotube has a length of about 0.25 μm to about 4 μm. In someembodiments, the carbon nanotube has a specific surface area of greaterthan about 60 m²/g In some embodiments, the carbon nanotube has anelectrical conductivity of greater than about 100 S/cm. In someembodiments, the carbon-based additive has a mean particle size of about2 μm to about 30 μm. In some embodiments, the carbon-based additive hasa specific surface area of about 2 m²/g to about 16 m²/g. In someembodiments, the carbon-based additive has a density of 0.5 g/cm³ toabout 4 g/cm³. In some embodiments, at least one of the graphene and thegraphene oxide has a specific surface area of greater than 1,000 m²/g.In some embodiments, at least one of the graphene and the graphene oxidehas a conductivity of about 1,000 S/m to about 4,000 S/m. In someembodiments, the reduced graphene oxide comprises reduced graphene oxidesheets having a width, length or both of about 0.3 μm to about 10 μm. Insome embodiments, the binder comprises a polymeric binder. In someembodiments, the polymeric binder comprises styrene butadiene rubber,polyvinylidene fluoride, polytetrafluoroethylene, polyvinyl pyrrolidone,ethyl cellulose, polyurethane, polyester, or any combination thereof. Insome embodiments, the solvent comprises a polar aprotic solvent, or apolar protic solvent. In some embodiments, the polar aprotic solventcomprises N-Methyl-2-pyrrolidone, or dichloromethane, tetrahydrofuran,ethyl acetate, acetone, dimethylformamide, acetonitrile, dimethylsulfoxide, propylene carbonate, or any combination thereof. In someembodiments, the polar protic solvent comprises water, formic acid,n-butanol, isopropanol, nitromethane, ethanol, methanol, acetic acid, orany combination thereof. In some embodiments, the surfactant comprisesan acid, a nonionic surfactant, or any combination thereof. In someembodiments, the acid comprises perfluorooctanoic acid, perfluorooctanesulfonate, perfluorohexane sulfonic acid, perfluorononanoic acid,perfluorodecanoic acid, or any combination thereof. In some embodiments,the nonionic surfactant comprises polyethylene glycol alkyl ether,octaethylene glycol monododecyl ether, pentaethylene glycol monododecylether, polypropylene glycol alkyl ether, glucoside alkyl ether, decylglucoside, lauryl glucoside, octyl glucoside, polyethylene glycoloctylphenyl ether, dodecyldimethylamine oxide, polyethylene glycolalkylphenyl ether, polyethylene glycol octylphenyl ether, Triton X-100(CAS 9002-93-1), polyethylene glycol alkylphenyl ether, nonoxynol-9,glycerol alkyl ester polysorbate, sorbitan alkyl ester, polyethoxylatedtallow amine, Dynol 604, Zonyl F5-300 (CAS 197664-69-0), or anycombination thereof. In some embodiments, the defoamer comprises aninsoluble oil, a silicone, a glycol, a stearate, an organic solvent,Surfynol DF-1100, alkyl polyacrylate, or any combination thereof. Insome embodiments, the insoluble oil comprises mineral oil, vegetableoil, white oil, or any combination thereof. In some embodiments, thesilicone comprises polydimethylsiloxane, silicone glycol, afluorosilicone, or any combination thereof. In some embodiments, theglycol comprises polyethylene glycol, ethylene glycol, propylene glycol,or any combination thereof. In some embodiments, the stearate comprisesglycol stearate, stearin, or any combination thereof. In someembodiments, the organic solvent comprises ethanol, isopropyl alcohol,N-methyl-2-pyrrolidone, cyclohexanone, terpineol,3-methoxy-3-methyl-1-butanol, 4-hydroxyl-4-methyl-pentan-2-one, methylisobutyl ketone, or any combination thereof. In some embodiments, theviscosity modifier comprises N-methyl-2-pyrrolidone, ethanol, isopropylalcohol, cyclohexanone, terpineol 3-methoxy-3-methyl-1-butanol,4-hydroxyl-4-methyl-pentane-2-one, methyl isobutyl ketone, or anycombination thereof. In some embodiments, the coating comprises about 2%to about 99% by weight of the conductive additive. In some embodiments,the coating comprises about 2% to about 90% by weight of the binder. Insome embodiments, the coating comprises about 40% to about 90% by weightof the solvent. In some embodiments, the coating comprises about 0.01%to about 10% by weight of the surfactant. In some embodiments, thecoating comprises about 0.1% to about 5% by weight of the defoamer. Insome embodiments, the substrate comprises a plastic, a metal, a glass, afabric, or any combination thereof. In some embodiments, the metalcomprises copper, aluminum, steel, stainless steel, or any combinationthereof. In some embodiments, the plastic comprises a thermoplastic. Insome embodiments, the thermoplastic comprises polyethyleneterephthalate, polyglycolic acid, polylactic acid, polycaprolactone,polyhydroxyalkanoate, polyhydroxybutyrate, polyethylene adipate,polybutylene succinate, poly(3-hydroxybutyrate-co-3-hydroxyvalerate),polybutylene terephthalate, polytrimethylene terephthalate, polyethylenenaphthalate, or any combination thereof. In some embodiments, a setthickness of the coating is deposited on the substrate. In someembodiments, drying the coating on the substrate comprises drying at atemperature of about 20° C. to about 120° C. In some embodiments,forming the coating comprises: mixing the coating; breaking downagglomerates in the coating; removing air bubbles from the coating; orany combination thereof. In some embodiments, the mixing is performed byan acoustic mixer, a planetary mixer, a powder mixer, or any combinationthereof. In some embodiments, the breaking down of the agglomerates inthe coating is performed by a high shear mixer. In some embodiments, theremoving of the air bubbles from the coating is performed by a vacuummixer. In some embodiments, depositing the coating on a substratecomprises depositing the coating on the substrate with a coatingmachine, a doctor's blade, a table-top coater, an air sprayer, or anycombination thereof. In some embodiments, the coating machine is a slotdie coating machine. In some embodiments, at least one of the breakingdown of the agglomerates in the coating and the removing of the airbubbles from the coating is performed until the coating has a viscosityof about 1,000 mPa/s to about 5,000 mPa/s. In some embodiments, thecoating has a viscosity of about 1,000 mPa/s to about 5,000 mPa/s. Insome embodiments, the method further comprises calendaring theelectromagnetic shield. In some embodiments, calendaring is performed bya roll to roll calendaring machine. In some embodiments, theelectromagnetic shield has a conductivity of about 10 S/m to about20,000 S/m. In some embodiments, the electromagnetic shield has a sheetresistance of about 0.1 ohm/sq to about 1,000 ohm/sq. In someembodiments, the electromagnetic shield has an operating temperature ofat about 0° C. to about 400° C. In some embodiments, the electromagneticshield has a thickness of about 10 μm to about 2,000 μm. In someembodiments, the electromagnetic shield has a shielding effectiveness inthe frequency range of about 10 kHz to about 40 MHz of about 20 dB toabout 40 dB with a film thickness of less than about 100 μm. In someembodiments, the electromagnetic shield has a shielding effectiveness inthe frequency range of 1 GHz to 40 GHz of about 40 dB to about 120 dBwith a film thickness of less than about 100 μm. In some embodiments,the electromagnetic shield has a shielding effectiveness in thefrequency range of about 10 kHz to about 30 kHz of about 5 dB to about40 dB. In some embodiments, the electromagnetic shield has a shieldingeffectiveness in the frequency range of about 40 kHz to about 100 MHz ofabout 1 dB to about 100 dB. In some embodiments, the electromagneticshield has a shielding effectiveness in the frequency range of about 200MHz to about 1 GHz of about 1 dB to about 100 dB. In some embodiments,the electromagnetic shield has a shielding effectiveness in thefrequency range of about 2 GHz to about 18 GHz of about 1 dB to about120 dB. In some embodiments, the electromagnetic shield has a shieldingeffectiveness in the frequency range of about 18 GHz to about 40 GHz ofabout 1 dB to about 120 dB. Another aspect provided herein is a methodof forming an electromagnetic shield, comprising: obtaining a coatingcomposition comprising: a conductive additive; a binder; a solvent; asurfactant; and a defoamer; depositing the coating composition on asubstrate; and drying the coating on the substrate.

BRIEF DESCRIPTION OF THE DRAWINGS

The novel features of the disclosure are set forth with particularity inthe appended claims. A better understanding of the features andadvantages of the present disclosure will be obtained by reference tothe following detailed description that sets forth illustrativeembodiments, in which the principles of the disclosure are utilized, andthe accompanying drawings of which:

FIG. 1 is a diagram of the reflection and absorption in anElectromagnetic Interference (EMI) shield;

FIG. 2A shows a first perspective view of an EMI shield;

FIG. 2B shows a second perspective view of an EMI shield;

FIG. 2C shows a third perspective view of an EMI shield;

FIG. 3A shows a low magnification microscopy image of a first EMI shieldaccording to a non-limiting embodiment;

FIG. 3B shows a high magnification microscopy image of a first EMIshield according to a non-limiting embodiment;

FIG. 4A shows a low magnification microscopy image of a third EMI shieldaccording to a non-limiting embodiment;

FIG. 4B shows a high magnification microscopy image of a third EMIshield according to a non-limiting embodiment;

FIG. 5A shows a low magnification microscopy image of a fourth EMIshield according to a non-limiting embodiment;

FIG. 5B shows a high magnification microscopy image of a fourth EMIshield according to a non-limiting embodiment;

FIG. 6 shows a diagram of an EMI shield effectiveness testing setup;

FIG. 7 shows a table listing examples of EMI shielding samples;

FIG. 8 shows a graph of shielding effectiveness in decibels verses anemitted test frequency in megahertz (MHz) for sixth to eleventh EMIfiltering samples;

FIG. 9 shows a graph of shielding effectiveness in decibels verses anemitted test frequency in GHz for twelfth to twenty-first EMI filteringsamples;

FIG. 10 shows a graph of shielding effectiveness in decibels verses anemitted test frequency in GHz for twenty-second to thirty-third EMIfiltering samples;

FIG. 11 shows a graph of shielding effectiveness in decibels verses anemitted test frequency in gigahertz (GHz) for 3 EMI filtering samples ofdifferent thicknesses;

FIG. 12 shows a graph of shielding effectiveness in decibels verses anemitted test frequency in GHz for 3 EMI filtering samples;

FIG. 13 shows a graph of shielding effectiveness in decibels verses anemitted test frequency in GHz for an exemplary filtering sample;

FIG. 14 shows an image displaying the flexibility of an exemplaryfiltering sample; and

FIG. 15 shows an image of applying the coating to a substrate.

DETAILED DESCRIPTION

Current EMI shielding materials employ metals or metal composites fortheir high conductivity, however such materials can be difficult toprocess and are susceptible to chemical corrosions and oxidations,resulting in reduced shielding effectiveness over time.

Provided herein are carbon-based electromagnetic interference shieldingdevices and shielding materials, and preparation methods thereof. TheEMI shields and shield coatings herein prevent or reduce RF signals andwaves from passing therethrough. In some embodiments, the EMI shieldingdevices are formed by a coating deposited on a substrate. In someembodiments, the EMI shielding devices are formed with compressionmolding techniques. The EMI shielding devices can be shaped from one ormore sheets. The sheets can be thin, flexible, lightweight, and/orcorrosion resistant. The EMI shielding materials can be adapted toprovide EMI shielding or filtering according to the desired effect. Asan example, an EMI shield can be shaped as an enclosure (e.g., a boxshape enclosing sensitive electronics). As another example, EMIshielding materials can be cut into thin, flexible sheets sized to thewalls of a room, and then applied to the walls, optionally with anadhesive on one side of the sheets, in order to generate an EMI shieldedroom. Accordingly, the various advantages of the present disclosureinclude allowing EMI shielding to be efficiently adapted to devices,rooms, vehicles, or other relevant implementations, even when suchimplementations were not designed for or even originally contemplate EMIshielding.

EMI Shielding Mechanics

FIG. 1 shows a diagram of the reflection and absorption in anElectromagnetic Interference (EMI) shield 110. As shown therein, a firstexternally reflected portion 102 (e.g., a d-wave reflectance) of anincident t-wave 101 is reflected by an outer proximal surface 110A ofthe EMI shield, whereas an absorbed portion 103 of the t-wave 101 isabsorbed into the EMI shield 110. A first internally reflected portion104 of the absorbed portion 103 reflects off an interior distal surface110B of the EMI shield 110 wherein a first attenuated portion 105 of thefirst absorbed portion 103 is transmitted distally through the EMIshield 110. Thereafter, a second internally reflected portion 106 of thefirst internally reflected portion 104 reflects off an interior proximalsurface 110C of the EMI shield 110 wherein a second externally reflectedportion 107 of the first internally reflected portion 104 is transmittedproximally towards the source of the incident t-wave 101 and parallel tothe first externally reflected portion 102. The internal reflectioncontinues as a third internally reflected portion 109 of the secondinternally reflected portion 106 reflects off an interior distal surface110B of the EMI shield 110 wherein a second attenuated portion 108 ofthe second internally reflected portion 106 is transmitted distally intothe EMI shield 110.

In some embodiments, the effectiveness of the EMI 110 shield correlatesto a ratio between a strength the incident t-wave 101 and the sum of thestrengths of the first attenuated portion 105 and the second attenuatedportion 108. In some embodiments, the effectiveness of the EMI 110shield correlates to a ratio between the sum of the strengths of thefirst externally reflected portion 102 and the second externallyreflected portion 107 and the sum of the strengths of the firstattenuated portion 105 and the second attenuated portion 108. In someembodiments, the effectiveness of the EMI 110 shield correlates to aratio between the sum of the strengths of the first externally reflectedportion 102 and the second externally reflected portion 107 and thestrength of the incident t-wave 101.

EMI Shields

Provided herein is an electromagnetic shield comprising: a substrate; aconductive additive; and a binder incorporated with the conductiveadditive and deposited on the substrate. In some embodiments, theconductive additive and the binder are mixed together to form a coating.In some embodiments, the conductive additive and the binder form acarbon-polymer nanocomposite. In some embodiments, the conductiveadditive and the binder form a physically robust and chemicallyresistant matrix with a high electrical conductivity. In someembodiments, the conductive additive acts as a physical/mechanicalenhancer for the binder matrix, enabling improved hardness, tensilestrength, and flexibility. In some embodiments, the EMI shields orshielding materials are configured to be water resistant and/orwaterproof. In some embodiments, the EMI shields or shielding materialsare configured to have structural flexibility and/or resilience. In someembodiments, the EMI shields or shielding materials are configured to bescratch resistant. For example, in some embodiments, the EMI shields orshielding materials comprise binders or binder compositions such ascarboxylated styrene acrylic latex (e.g., Trinseo 9501) and/or acrylic(e.g., Rustoleum 710). In some embodiments, the carboxylated styreneacrylic latex composition is present in the EMI shield orslurry/composition for forming the EMI shield at a dry weight (w/w)percentage (i.e., dry mass only). In some embodiments, theelectromagnetic shield comprises a percentage by weight of the binder orbinder composition (e.g., carboxylated styrene acrylic latex and/oracrylic) of about 5% to about 50%. In some embodiments, theelectromagnetic shield comprises a percentage by weight of the binder orbinder composition of about 5% to about 10%, about 5% to about 20%,about 5% to about 30%, about 5% to about 40%, about 5% to about 50%,about 10% to about 20%, about 10% to about 30%, about 10% to about 40%,about 10% to about 50%, about 20% to about 30%, about 20% to about 40%,about 20% to about 50%, about 30% to about 40%, about 30% to about 50%,or about 40% to about 50%. In some embodiments, the electromagneticshield comprises a percentage by weight of the binder or bindercomposition of about 5%, about 10%, about 20%, about 30%, about 40%, orabout 50%. In some embodiments, the electromagnetic shield comprises apercentage by weight of the binder or binder composition of at leastabout 5%, about 10%, about 20%, about 30%, or about 40%. In someembodiments, the electromagnetic shield comprises a percentage by weightof the binder or binder composition of at most about 10%, about 20%,about 30%, about 40%, or about 50%. In some embodiments, theelectromagnetic shield comprises between about 10% to about 20% of thecarboxylated styrene acrylic latex. In some embodiments, theelectromagnetic shield comprises between about 20% to about 30% of theacrylic.

In some embodiments, the electromagnetic shield comprises a stack of aplurality of electromagnetic shields. In some embodiments, theelectromagnetic shield further comprises a scratch resistant coating, animpact resistant coating, or any combination thereof. In someembodiments, the electromagnetic shield is flexible. FIG. 14 shows animage displaying the flexibility of an exemplary filtering sample. Insome embodiments, the electromagnetic shield is rigid. In someembodiments, the electromagnetic shield is flat. In some embodiments,the electromagnetic shield is curved. In some embodiments, theelectromagnetic shield is formed into a single surface. In someembodiments, the electromagnetic shield is formed into a plurality ofsurfaces.

In some embodiments, the substrate comprises a plastic, a metal, aglass, a fabric, or any combination thereof. In some embodiments, themetal comprises copper, aluminum, steel, stainless steel, beryllium,bismuth, chromium, cobalt, gallium, gold, indium, iron, lead, magnesium,nickel, silver, titanium, tin, zinc, or any combination thereof. In someembodiments, the plastic comprises a thermoplastic. In some embodiments,the thermoplastic comprises polyethylene terephthalate, polyglycolicacid, polylactic acid, polycaprolactone, polyhydroxyalkanoate,polyhydroxybutyrate, polyethylene adipate, polybutylene succinate,poly(3-hydroxybutyrate-co-3-hydroxyvalerate), polybutyleneterephthalate, polytrimethylene terephthalate, polyethylene naphthalate,or any combination thereof. In some embodiments, the electromagneticshield does not comprise a substrate. In some embodiments, the substrateis planar. In some embodiments, the substrate is curved. In someembodiments, the substrate is rigid. In some embodiments, the substrateis flexible. In some embodiments, the substrate comprises a singlesurface. In some embodiments, the substrate comprises two or moresurfaces. In some embodiments, the substrate is a container for anelectrical device. In some embodiments, the substrate is flat. In someembodiments, the substrate is curved. In some embodiments, the substratecomprises two or more surfaces. In some embodiments, the conductiveadditives, binders, or both herein enable the use of a plasticsubstrate.

In some embodiments, the binder comprises a polymeric binder. In someembodiments, the polymeric binder comprises styrene butadiene rubber,polyvinylidene fluoride, polytetrafluoroethylene, polyvinyl pyrrolidone,ethyl cellulose, polyurethane, polyester, carboxymethyl cellulose,polyurethane, polyester, polyvinyl alcohol, or any combination thereof.In some embodiments, the binder forms a robust yet flexible matrix forthe composite materials mixed therewith. In some embodiments, the binderadheres the active materials and conductive agents together and onto thesubstrate. In some embodiments, the specific binders herein enable theuse a variety of different substrates. In some embodiments, the polymerbinder forms a robust yet flexible matrix for the composite materials.

In some embodiments, the conductive additive comprises a carbon-basedadditive. In some embodiments, the carbon-based additive comprises,graphite, graphene, reduced graphene, graphene oxide, reduced grapheneoxide, carbon black, cabot carbon, a carbon nanotube, a functionalizedcarbon nanotube, or any combination thereof. In some embodiments, thecarbon-based additive is reduced. In some embodiments, the carbon-basedadditive is porous. In some embodiments, the carbon-based additivecomprises nanoplatelets, nanofibers, nanotubes, nanoparticles, nanorods,nanowires, nanoflowers, nanoflakes, nanofibers, nanoplatelets,nanoribbons, nanocubes, bipyramids, nanodiscs, nanoplates,nanodendrites, nanoleaves, nanospheres, quantum spheres, quantum dots,nanosprings, nanosheets, or any combination thereof. In someembodiments, the carbon nanotube is a multi-walled nanotube, asingle-walled nanotube, or a combination thereof. In some embodiments,the conductive additive is functionalized. In some embodiments, theconductive additive is functionalized with an oxygen containing group.In some embodiments, the functionalized carbon nanotube isfunctionalized with hydroxide, carboxylic acid, or both. In someembodiments, the conductive additive has a high electrical conductivity.In some embodiments, the conductive additive uniformly blends withvarious polymers and resins in a wet coating or dry powder.

In some embodiments, the electromagnetic shield comprises a percentageby weight of the conductive additive of about 2.5% to about 99%. In someembodiments, the electromagnetic shield comprises a percentage by weightof the conductive additive of about 2.5% to about 5%, about 2.5% toabout 10%, about 2.5% to about 15%, about 2.5% to about 20%, about 2.5%to about 30%, about 2.5% to about 40%, about 2.5% to about 50%, about2.5% to about 60%, about 2.5% to about 70%, about 2.5% to about 80%,about 2.5% to about 99%, about 5% to about 10%, about 5% to about 15%,about 5% to about 20%, about 5% to about 30%, about 5% to about 40%,about 5% to about 50%, about 5% to about 60%, about 5% to about 70%,about 5% to about 80%, about 5% to about 99%, about 10% to about 15%,about 10% to about 20%, about 10% to about 30%, about 10% to about 40%,about 10% to about 50%, about 10% to about 60%, about 10% to about 70%,about 10% to about 80%, about 10% to about 99%, about 15% to about 20%,about 15% to about 30%, about 15% to about 40%, about 15% to about 50%,about 15% to about 60%, about 15% to about 70%, about 15% to about 80%,about 15% to about 99%, about 20% to about 30%, about 20% to about 40%,about 20% to about 50%, about 20% to about 60%, about 20% to about 70%,about 20% to about 80%, about 20% to about 99%, about 30% to about 40%,about 30% to about 50%, about 30% to about 60%, about 30% to about 70%,about 30% to about 80%, about 30% to about 99%, about 40% to about 50%,about 40% to about 60%, about 40% to about 70%, about 40% to about 80%,about 40% to about 99%, about 50% to about 60%, about 50% to about 70%,about 50% to about 80%, about 50% to about 99%, about 60% to about 70%,about 60% to about 80%, about 60% to about 99%, about 70% to about 80%,about 70% to about 99%, or about 80% to about 99%. In some embodiments,the electromagnetic shield comprises a percentage by weight of theconductive additive of about 2.5%, about 5%, about 10%, about 15%, about20%, about 30%, about 40%, about 50%, about 60%, about 70%, about 80%,or about 99%. In some embodiments, the electromagnetic shield comprisesa percentage by weight of the conductive additive of at least about2.5%, about 5%, about 10%, about 15%, about 20%, about 30%, about 40%,about 50%, about 60%, about 70%, or about 80%. In some embodiments, theelectromagnetic shield comprises a percentage by weight of theconductive additive of at most about 5%, about 10%, about 15%, about20%, about 30%, about 40%, about 50%, about 60%, about 70%, about 80%,or about 99%.

In some embodiments, the carbon-based additive has a specific surfacearea of about 2 m²/g to about 16 m²/g. In some embodiments, thecarbon-based additive has a specific surface area of about 2 m²/g toabout 4 m²/g, about 2 m²/g to about 6 m²/g, about 2 m²/g to about 8m²/g, about 2 m²/g to about 10 m²/g, about 2 m²/g to about 12 m²/g,about 2 m²/g to about 14 m²/g, about 2 m²/g to about 16 m²/g, about 4m²/g to about 6 m²/g, about 4 m²/g to about 8 m²/g, about 4 m²/g toabout 10 m²/g, about 4 m²/g to about 12 m²/g, about 4 m²/g to about 14m²/g, about 4 m²/g to about 16 m²/g, about 6 m²/g to about 8 m²/g, about6 m²/g to about 10 m²/g, about 6 m²/g to about 12 m²/g, about 6 m²/g toabout 14 m²/g, about 6 m²/g to about 16 m²/g, about 8 m²/g to about 10m²/g, about 8 m²/g to about 12 m²/g, about 8 m²/g to about 14 m²/g,about 8 m²/g to about 16 m²/g, about 10 m²/g to about 12 m²/g, about 10m²/g to about 14 m²/g, about 10 m²/g to about 16 m²/g, about 12 m²/g toabout 14 m²/g, about 12 m²/g to about 16 m²/g, or about 14 m²/g to about16 m²/g. In some embodiments, the carbon-based additive has a specificsurface area of about 2 m²/g, about 4 m²/g, about 6 m²/g, about 8 m²/g,about 10 m²/g, about 12 m²/g, about 14 m²/g, or about 16 m²/g. In someembodiments, the carbon-based additive has a specific surface area of atleast about 2 m²/g, about 4 m²/g, about 6 m²/g, about 8 m²/g, about 10m²/g, about 12 m²/g, or about 14 m²/g. In some embodiments, thecarbon-based additive has a specific surface area of at most about 4m²/g, about 6 m²/g, about 8 m²/g, about 10 m²/g, about 12 m²/g, about 14m²/g, or about 16 m²/g.

In some embodiments, the carbon-based additive has a density of about0.5 g/cm³ to about 4 g/cm³. In some embodiments, the carbon-basedadditive has a density of about 0.5 g/cm³ to about 0.75 g/cm³, about 0.5g/cm³ to about 1 g/cm³, about 0.5 g/cm³ to about 1.5 g/cm³, about 0.5g/cm³ to about 2 g/cm³, about 0.5 g/cm³ to about 2.5 g/cm³, about 0.5g/cm³ to about 3 g/cm³, about 0.5 g/cm³ to about 3.5 g/cm³, about 0.5g/cm³ to about 4 g/cm³, about 0.75 g/cm³ to about 1 g/cm³, about 0.75g/cm³ to about 1.5 g/cm³, about 0.75 g/cm³ to about 2 g/cm³, about 0.75g/cm³ to about 2.5 g/cm³, about 0.75 g/cm³ to about 3 g/cm³, about 0.75g/cm³ to about 3.5 g/cm³, about 0.75 g/cm³ to about 4 g/cm³, about 1g/cm³ to about 1.5 g/cm³, about 1 g/cm³ to about 2 g/cm³, about 1 g/cm³to about 2.5 g/cm³, about 1 g/cm³ to about 3 g/cm³, about 1 g/cm³ toabout 3.5 g/cm³, about 1 g/cm³ to about 4 g/cm³, about 1.5 g/cm³ toabout 2 g/cm³, about 1.5 g/cm³ to about 2.5 g/cm³, about 1.5 g/cm³ toabout 3 g/cm³, about 1.5 g/cm³ to about 3.5 g/cm³, about 1.5 g/cm³ toabout 4 g/cm³, about 2 g/cm³ to about 2.5 g/cm³, about 2 g/cm³ to about3 g/cm³, about 2 g/cm³ to about 3.5 g/cm³, about 2 g/cm³ to about 4g/cm³, about 2.5 g/cm³ to about 3 g/cm³, about 2.5 g/cm³ to about 3.5g/cm³, about 2.5 g/cm³ to about 4 g/cm³, about 3 g/cm³ to about 3.5g/cm³, about 3 g/cm³ to about 4 g/cm³, or about 3.5 g/cm³ to about 4g/cm³. In some embodiments, the carbon-based additive has a density ofabout 0.5 g/cm³, about 0.75 g/cm³, about 1 g/cm³, about 1.5 g/cm³, about2 g/cm³, about 2.5 g/cm³, about 3 g/cm³, about 3.5 g/cm³, or about 4g/cm³. In some embodiments, the carbon-based additive has a density ofat least about 0.5 g/cm³, about 0.75 g/cm³, about 1 g/cm³, about 1.5g/cm³, about 2 g/cm³, about 2.5 g/cm³, about 3 g/cm³, or about 3.5g/cm³. In some embodiments, the carbon-based additive has a density ofat most about 0.75 g/cm³, about 1 g/cm³, about 1.5 g/cm³, about 2 g/cm³,about 2.5 g/cm³, about 3 g/cm³, about 3.5 g/cm³, or about 4 g/cm³.

In some embodiments, at least one of the graphene and the graphene oxidehas a conductivity of about 1,000 S/m to about 4,000 S/m. In someembodiments, at least one of the graphene and the graphene oxide has aconductivity of about 1,000 S/m to about 1,500 S/m, about 1,000 S/m toabout 2,000 S/m, about 1,000 S/m to about 2,500 S/m, about 1,000 S/m toabout 3,000 S/m, about 1,000 S/m to about 3,500 S/m, about 1,000 S/m toabout 4,000 S/m, about 1,500 S/m to about 2,000 S/m, about 1,500 S/m toabout 2,500 S/m, about 1,500 S/m to about 3,000 S/m, about 1,500 S/m toabout 3,500 S/m, about 1,500 S/m to about 4,000 S/m, about 2,000 S/m toabout 2,500 S/m, about 2,000 S/m to about 3,000 S/m, about 2,000 S/m toabout 3,500 S/m, about 2,000 S/m to about 4,000 S/m, about 2,500 S/m toabout 3,000 S/m, about 2,500 S/m to about 3,500 S/m, about 2,500 S/m toabout 4,000 S/m, about 3,000 S/m to about 3,500 S/m, about 3,000 S/m toabout 4,000 S/m, or about 3,500 S/m to about 4,000 S/m. In someembodiments, at least one of the graphene and the graphene oxide has aconductivity of about 1,000 S/m, about 1,500 S/m, about 2,000 S/m, about2,500 S/m, about 3,000 S/m, about 3,500 S/m, or about 4,000 S/m. In someembodiments, at least one of the graphene and the graphene oxide has aconductivity of at least about 1,000 S/m, about 1,500 S/m, about 2,000S/m, about 2,500 S/m, about 3,000 S/m, or about 3,500 S/m. In someembodiments, at least one of the graphene and the graphene oxide has aconductivity of at most about 1,500 S/m, about 2,000 S/m, about 2,500S/m, about 3,000 S/m, about 3,500 S/m, or about 4,000 S/m.

In some embodiments, the reduced graphene oxide comprises reducedgraphene oxide sheets. In some embodiments, the reduced graphene oxidesheets have a width, length or both of about 0.3 μm to about 10 μm. Insome embodiments, the reduced graphene oxide sheets have a width, lengthor both of about 0.3 μm to about 0.5 μm, about 0.3 μm to about 1 μm,about 0.3 μm to about 2 μm, about 0.3 μm to about 3 μm, about 0.3 μm toabout 4 μm, about 0.3 μm to about 5 μm, about 0.3 μm to about 6 μm,about 0.3 μm to about 7 μm, about 0.3 μm to about 8 μm, about 0.3 μm toabout 9 μm, about 0.3 μm to about 10 μm, about 0.5 μm to about 1 μm,about 0.5 μm to about 2 μm, about 0.5 μm to about 3 μm, about 0.5 μm toabout 4 μm, about 0.5 μm to about 5 μm, about 0.5 μm to about 6 μm,about 0.5 μm to about 7 μm, about 0.5 μm to about 8 μm, about 0.5 μm toabout 9 μm, about 0.5 μm to about 10 μm, about 1 μm to about 2 μm, about1 μm to about 3 μm, about 1 μm to about 4 μm, about 1 μm to about 5 μm,about 1 μm to about 6 μm, about 1 μm to about 7 μm, about 1 μm to about8 μm, about 1 μm to about 9 μm, about 1 μm to about 10 μm, about 2 μm toabout 3 μm, about 2 μm to about 4 μm, about 2 μm to about 5 μm, about 2μm to about 6 μm, about 2 μm to about 7 μm, about 2 μm to about 8 μm,about 2 μm to about 9 μm, about 2 μm to about 10 μm, about 3 μm to about4 μm, about 3 μm to about 5 μm, about 3 μm to about 6 μm, about 3 μm toabout 7 μm, about 3 μm to about 8 μm, about 3 μm to about 9 μm, about 3μm to about 10 μm, about 4 μm to about 5 μm, about 4 μm to about 6 μm,about 4 μm to about 7 μm, about 4 μm to about 8 μm, about 4 μm to about9 μm, about 4 μm to about 10 μm, about 5 μm to about 6 μm, about 5 μm toabout 7 μm, about 5 μm to about 8 μm, about 5 μm to about 9 μm, about 5μm to about 10 μm, about 6 μm to about 7 μm, about 6 μm to about 8 μm,about 6 μm to about 9 μm, about 6 μm to about 10 μm, about 7 μm to about8 μm, about 7 μm to about 9 μm, about 7 μm to about 10 μm, about 8 μm toabout 9 μm, about 8 μm to about 10 μm, or about 9 μm to about 10 μm. Insome embodiments, the reduced graphene oxide sheets have a width, lengthor both of about 0.3 μm, about 0.5 μm, about 1 μm, about 2 μm, about 3μm, about 4 μm, about 5 μm, about 6 μm, about 7 μm, about 8 μm, about 9μm, or about 10 μm. In some embodiments, the reduced graphene oxidesheets have a width, length or both of at least about 0.3 μm, about 0.5μm, about 1 μm, about 2 μm, about 3 μm, about 4 μm, about 5 μm, about 6μm, about 7 μm, about 8 μm, or about 9 μm. In some embodiments, thereduced graphene oxide sheets have a width, length or both of at mostabout 0.5 μm, about 1 μm, about 2 μm, about 3 μm, about 4 μm, about 5μm, about 6 μm, about 7 μm, about 8 μm, about 9 μm, or about 10 μm.

In some embodiments, the carbon nanotube has an outside diameter ofabout 20 nm to about 60 nm. In some embodiments, the carbon nanotube hasan outside diameter of about 20 nm to about 25 nm, about 20 nm to about30 nm, about 20 nm to about 35 nm, about 20 nm to about 40 nm, about 20nm to about 45 nm, about 20 nm to about 50 nm, about 20 nm to about 55nm, about 20 nm to about 60 nm, about 25 nm to about 30 nm, about 25 nmto about 35 nm, about 25 nm to about 40 nm, about 25 nm to about 45 nm,about 25 nm to about 50 nm, about 25 nm to about 55 nm, about 25 nm toabout 60 nm, about 30 nm to about 35 nm, about 30 nm to about 40 nm,about 30 nm to about 45 nm, about 30 nm to about 50 nm, about 30 nm toabout 55 nm, about 30 nm to about 60 nm, about 35 nm to about 40 nm,about 35 nm to about 45 nm, about 35 nm to about 50 nm, about 35 nm toabout 55 nm, about 35 nm to about 60 nm, about 40 nm to about 45 nm,about 40 nm to about 50 nm, about 40 nm to about 55 nm, about 40 nm toabout 60 nm, about 45 nm to about 50 nm, about 45 nm to about 55 nm,about 45 nm to about 60 nm, about 50 nm to about 55 nm, about 50 nm toabout 60 nm, or about 55 nm to about 60 nm. In some embodiments, thecarbon nanotube has an outside diameter of about 20 nm, about 25 nm,about 30 nm, about 35 nm, about 40 nm, about 45 nm, about 50 nm, about55 nm, or about 60 nm. In some embodiments, the carbon nanotube has anoutside diameter of at least about 20 nm, about 25 nm, about 30 nm,about 35 nm, about 40 nm, about 45 nm, about 50 nm, or about 55 nm. Insome embodiments, the carbon nanotube has an outside diameter of at mostabout 25 nm, about 30 nm, about 35 nm, about 40 nm, about 45 nm, about50 nm, about 55 nm, or about 60 nm.

In some embodiments, the carbon nanotube has a length of about 0.25 μmto about 4 μm. In some embodiments, the carbon nanotube has a length ofabout 0.25 μm to about 0.5 μm, about 0.25 μm to about 0.75 μm, about0.25 μm to about 1 μm, about 0.25 μm to about 1.5 μm, about 0.25 μm toabout 2 μm, about 0.25 μm to about 2.5 μm, about 0.25 μm to about 3 μm,about 0.25 μm to about 3.5 μm, about 0.25 μm to about 4 μm, about 0.5 μmto about 0.75 μm, about 0.5 μm to about 1 μm, about 0.5 μm to about 1.5μm, about 0.5 μm to about 2 μm, about 0.5 μm to about 2.5 μm, about 0.5μm to about 3 μm, about 0.5 μm to about 3.5 μm, about 0.5 μm to about 4μm, about 0.75 μm to about 1 μm, about 0.75 μm to about 1.5 μm, about0.75 μm to about 2 μm, about 0.75 μm to about 2.5 μm, about 0.75 μm toabout 3 μm, about 0.75 μm to about 3.5 μm, about 0.75 μm to about 4 μm,about 1 μm to about 1.5 μm, about 1 μm to about 2 μm, about 1 μm toabout 2.5 μm, about 1 μm to about 3 μm, about 1 μm to about 3.5 μm,about 1 μm to about 4 μm, about 1.5 μm to about 2 μm, about 1.5 μm toabout 2.5 μm, about 1.5 μm to about 3 μm, about 1.5 μm to about 3.5 μm,about 1.5 μm to about 4 μm, about 2 μm to about 2.5 μm, about 2 μm toabout 3 μm, about 2 μm to about 3.5 μm, about 2 μm to about 4 μm, about2.5 μm to about 3 μm, about 2.5 μm to about 3.5 μm, about 2.5 μm toabout 4 μm, about 3 μm to about 3.5 μm, about 3 μm to about 4 μm, orabout 3.5 μm to about 4 μm. In some embodiments, the carbon nanotube hasa length of about 0.25 μm, about 0.5 μm, about 0.75 μm, about 1 μm,about 1.5 μm, about 2 μm, about 2.5 μm, about 3 μm, about 3.5 μm, orabout 4 μm. In some embodiments, the carbon nanotube has a length of atleast about 0.25 μm, about 0.5 μm, about 0.75 μm, about 1 μm, about 1.5μm, about 2 μm, about 2.5 μm, about 3 μm, or about 3.5 μm. In someembodiments, the carbon nanotube has a length of at most about 0.5 μm,about 0.75 μm, about 1 μm, about 1.5 μm, about 2 μm, about 2.5 μm, about3 μm, about 3.5 μm, or about 4 μm.

In some embodiments, the carbon nanotube has a specific surface area ofgreater than about 30 m²/g, 40 m²/g, 50 m²/g, 60 m²/g, 70 m²/g, 80 m²/g,90 m²/g, 100 m²/g, 110 m²/g, 120 m²/g, or more including incrementstherein. In some embodiments, the carbon nanotube has an electricalconductivity of greater than about 50 s/cm, 60 s/cm, 70 s/cm, 80 s/cm,90 s/cm, 100 S/cm 120 s/cm, 140 s/cm, 160 s/cm, 180 s/cm, 200 s/cm, ormore including increments therein.

In some embodiments, the carbon-based additive has a mean particle sizeof about 2 μm to about 30 μm. In some embodiments, the carbon-basedadditive has a mean particle size of about 2 μm to about 4 μm, about 2μm to about 6 μm, about 2 μm to about 8 μm, about 2 μm to about 10 μm,about 2 μm to about 14 μm, about 2 μm to about 18 μm, about 2 μm toabout 22 μm, about 2 μm to about 26 μm, about 2 μm to about 30 μm, about4 μm to about 6 μm, about 4 μm to about 8 μm, about 4 μm to about 10 μm,about 4 μm to about 14 μm, about 4 μm to about 18 μm, about 4 μm toabout 22 μm, about 4 μm to about 26 μm, about 4 μm to about 30 μm, about6 μm to about 8 μm, about 6 μm to about 10 μm, about 6 μm to about 14μm, about 6 μm to about 18 μm, about 6 μm to about 22 μm, about 6 μm toabout 26 μm, about 6 μm to about 30 μm, about 8 μm to about 10 μm, about8 μm to about 14 μm, about 8 μm to about 18 μm, about 8 μm to about 22μm, about 8 μm to about 26 μm, about 8 μm to about 30 μm, about 10 μm toabout 14 μm, about 10 μm to about 18 μm, about 10 μm to about 22 μm,about 10 μm to about 26 μm, about 10 μm to about 30 μm, about 14 μm toabout 18 μm, about 14 μm to about 22 μm, about 14 μm to about 26 μm,about 14 μm to about 30 μm, about 18 μm to about 22 μm, about 18 μm toabout 26 μm, about 18 μm to about 30 μm, about 22 μm to about 26 μm,about 22 μm to about 30 μm, or about 26 μm to about 30 μm. In someembodiments, the carbon-based additive has a mean particle size of about2 μm, about 4 μm, about 6 μm, about 8 μm, about 10 μm, about 14 μm,about 18 μm, about 22 μm, about 26 μm, or about 30 μm. In someembodiments, the carbon-based additive has a mean particle size of atleast about 2 μm, about 4 μm, about 6 μm, about 8 μm, about 10 μm, about14 μm, about 18 μm, about 22 μm, or about 26 μm. In some embodiments,the carbon-based additive has a mean particle size of at most about 4μm, about 6 μm, about 8 μm, about 10 μm, about 14 μm, about 18 μm, about22 μm, about 26 μm, or about 30 μm.

In some embodiments, the electromagnetic shield has a thickness of about10 μm to about 2,000 μm. In some embodiments, the electromagnetic shieldhas a thickness of about 10 μm to about 100 μm, about 10 μm to about 250μm, about 10 μm to about 500 μm, about 10 μm to about 750 μm, about 10μm to about 1,000 μm, about 10 μm to about 1,250 μm, about 10 μm toabout 1,500 μm, about 10 μm to about 1,750 μm, about 10 μm to about2,000 μm, about 100 μm to about 250 μm, about 100 μm to about 500 μm,about 100 μm to about 750 μm, about 100 μm to about 1,000 μm, about 100μm to about 1,250 μm, about 100 μm to about 1,500 μm, about 100 μm toabout 1,750 μm, about 100 μm to about 2,000 μm, about 250 μm to about500 μm, about 250 μm to about 750 μm, about 250 μm to about 1,000 μm,about 250 μm to about 1,250 μm, about 250 μm to about 1,500 μm, about250 μm to about 1,750 μm, about 250 μm to about 2,000 μm, about 500 μmto about 750 μm, about 500 μm to about 1,000 μm, about 500 μm to about1,250 μm, about 500 μm to about 1,500 μm, about 500 μm to about 1,750μm, about 500 μm to about 2,000 μm, about 750 μm to about 1,000 μm,about 750 μm to about 1,250 μm, about 750 μm to about 1,500 μm, about750 μm to about 1,750 μm, about 750 μm to about 2,000 μm, about 1,000 μmto about 1,250 μm, about 1,000 μm to about 1,500 μm, about 1,000 μm toabout 1,750 μm, about 1,000 μm to about 2,000 μm, about 1,250 μm toabout 1,500 μm, about 1,250 μm to about 1,750 μm, about 1,250 μm toabout 2,000 μm, about 1,500 μm to about 1,750 μm, about 1,500 μm toabout 2,000 μm, or about 1,750 μm to about 2,000 μm, includingincrements therein. In some embodiments, the electromagnetic shield hasa thickness of about 10 μm, about 100 μm, about 250 μm, about 500 μm,about 750 μm, about 1,000 μm, about 1,250 μm, about 1,500 μm, about1,750 μm, or about 2,000 μm. In some embodiments, the electromagneticshield has a thickness of at least about 10 μm, about 100 μm, about 250μm, about 500 μm, about 750 μm, about 1,000 μm, about 1,250 μm, about1,500 μm, or about 1,750 μm. In some embodiments, the electromagneticshield has a thickness of at most about 100 μm, about 250 μm, about 500μm, about 750 μm, about 1,000 μm, about 1,250 μm, about 1,500 μm, about1,750 μm, or about 2,000 μm. In some embodiments, the conductiveadditives, binders, or both, herein enable the shield thicknessesherein.

In some embodiments, the electromagnetic shield has a thermalconductivity of about 1 W/mK to about 5 W/mK. In some embodiments, theelectromagnetic shield has a thermal conductivity of at least about 1W/mK, 1.5 W/mK, 2 W/mK, 2.5 W/mK, 3 W/mK, 3.5 W/mK, 4 W/mK, or 4.5 W/mK,including increments therein. In some embodiments, the conductiveadditives, binders, or both, herein enable the high thermalconductivities herein.

EMI Shield Coatings

Provided herein are EMI shielding coatings comprising a conductiveadditive and a binder. In some embodiments, the EMI shielding coatingfurther comprises a solvent, a surfactant, a defoamer, or anycombination thereof. In some embodiments, the coating does not compriseat least one of the surfactant, and the defoamer. In some embodiments,the conductive additive and the binder form a carbon-polymernanocomposite. In some embodiments, the conductive additive and thebinder form a physically robust and chemically resistant matrix with ahigh electrical conductivity. In some embodiments, the conductiveadditive acts as a physical/mechanical enhancer for the binder matrix,enabling improved hardness, tensile strength, and flexibility.

In some embodiments, the EMI shielding coating is a one-part, aqueousconductive paint. In some embodiments, the EMI shielding coating isapplied to a surface by spraying, rolling, brushing or any combinationthereof. In some embodiments, applying the EMI shielding coating doesnot require heat treatment. In some embodiments, the EMI shieldingcoating is non-solvent based, enabling its application to, for example,plastics that are prone to solvent dissolution, such as polystyrene andpolyethylene. In some embodiments, the EMI shielding coating adheresstrongly to plastic, metal, glass and textile substrates. In someembodiments, the EMI shielding coating is safe for heat sensitivesubstrates.

In some embodiments, the EMI shielding coating is easily applied to avariety of substrates for a variety of applications. In someembodiments, the EMI shielding coating is configured for application toa substrate by spraying. In some embodiments, the EMI shielding coatingis configured for application to a substrate by air spraying. In someembodiments, the ability of the EMI shielding coating to be air sprayedonto a substrate enables its application to substrates of various shapesand materials. In some embodiments, the ability of the EMI shieldingcoating to be air sprayed onto a substrate enables its application tosubstrates with greater thickness uniformity. In some embodiments, theviscosities, particles sizes, concentrations, and components of the EMIshielding coatings herein enable its application by spray coating.

In some embodiments, when painted on a surface, the EMI shieldingcoating attenuates electromagnetic interference (EMI), radio frequencyinterference (RFI), or both. In some embodiments, when painted on asurface, the EMI shielding coating dissipates. In some embodiments, whenpainted on an surface of an electronics enclosure, the EMI shieldingcoating dissipates heat from the electronics therein to prevent or avoidtheir thermal shutdown. In some embodiments, the EMI shielding coatingis highly resistant to chemicals, corrosion, and scratches.

In some embodiments, the conductive additive comprises a carbon-basedadditive. In some embodiments, the carbon-based additive comprises,graphite, graphene, reduced graphene, graphene oxide, reduced grapheneoxide, carbon black, cabot carbon, a carbon nanotube, a functionalizedcarbon nanotube, or any combination thereof. In some embodiments, thecarbon-based additive is reduced. In some embodiments, the carbon-basedadditive is porous. In some embodiments, the carbon-based additivecomprises nanoplatelets, nanofibers, nanotubes, nanoparticles, nanorods,nanowires, nanoflowers, nanoflakes, nanofibers, nanoplatelets,nanoribbons, nanocubes, bipyramids, nanodiscs, nanoplates,nanodendrites, nanoleaves, nanospheres, quantum spheres, quantum dots,nanosprings, nanosheets, or any combination thereof. In someembodiments, the carbon nanotube is a multi-walled nanotube, asingle-walled nanotube, or a combination thereof. In some embodiments,the functionalized carbon nanotube is functionalized with hydroxide,carboxylic acid, or both. In some embodiments, the conductive additivesdescribed herein provide high conductivity, strength, and resilience.

In some embodiments, the binder comprises a polymeric binder. In someembodiments, the polymeric binder comprises styrene butadiene rubber,polyvinylidene fluoride, polytetrafluoroethylene, polyvinyl pyrrolidone,ethyl cellulose, polyurethane, polyester, or any combination thereof.

In some embodiments, the solvent comprises a polar aprotic solvent, or apolar protic solvent. In some embodiments, the polar aprotic solventcomprises N-Methyl-2-pyrrolidone, or dichloromethane, tetrahydrofuran,ethyl acetate, acetone, dimethylformamide, acetonitrile, dimethylsulfoxide, propylene carbonate, or any combination thereof. In someembodiments, the polar protic solvent comprises water, formic acid,n-butanol, isopropanol, nitromethane, ethanol, methanol, acetic acid, orany combination thereof.

In some embodiments, the surfactant comprises an acid, a nonionicsurfactant, or any combination thereof. In some embodiments, the acidcomprises perfluorooctanoic acid, perfluorooctane sulfonate,perfluorohexane sulfonic acid, perfluorononanoic acid, perfluorodecanoicacid, or any combination thereof. In some embodiments, the nonionicsurfactant comprises polyethylene glycol alkyl ether, octaethyleneglycol monododecyl ether, pentaethylene glycol monododecyl ether,polypropylene glycol alkyl ether, glucoside alkyl ether, decylglucoside, lauryl glucoside, octyl glucoside, polyethylene glycoloctylphenyl ether, dodecyldimethylamine oxide, polyethylene glycolalkylphenyl ether, polyethylene glycol octylphenyl ether, Triton X-100,polyethylene glycol alkylphenyl ether, nonoxynol-9, glycerol alkyl esterpolysorbate, sorbitan alkyl ester, polyethoxylated tallow amine, Dynol604, Zonyl F5-300, or any combination thereof.

In some embodiments, the defoamer comprises an insoluble oil, asilicone, a glycol, a stearate, an organic solvent, Surfynol DF-1100,alkyl polyacrylate, or any combination thereof. In some embodiments, theinsoluble oil comprises mineral oil, vegetable oil, white oil, or anycombination thereof. In some embodiments, the silicone comprisespolydimethylsiloxane, silicone glycol, a fluorosilicone, or anycombination thereof. In some embodiments, the glycol comprisespolyethylene glycol, ethylene glycol, propylene glycol, or anycombination thereof. In some embodiments, the stearate comprises glycolstearate, stearin, or any combination thereof. In some embodiments, theorganic solvent comprises ethanol, isopropyl alcohol,N-methyl-2-pyrrolidone, cyclohexanone, terpineol,3-methoxy-3-methyl-1-butanol, 4-hydroxyl-4-methyl-pentan-2-one, methylisobutyl ketone, or any combination thereof.

In some embodiments, the viscosity modifier comprisesN-methyl-2-pyrrolidone, ethanol, isopropyl alcohol, cyclohexanone,terpineol 3-methoxy-3-methyl-1-butanol,4-hydroxyl-4-methyl-pentane-2-one, methyl isobutyl ketone, or anycombination thereof.

In some embodiments, the coating comprises more than one conductiveadditive, for example, two, three, or four or more conductive additives.In some embodiments, the coating comprises one or more of graphite,graphene (or reduced graphene oxide), carbon black (e.g., cabot carbon,C45 or C65), carbon nanotubes (e.g., functionalized carbon nanotubes OHor COOH), or carbon fiber. The percentage by weight of any givenconductive additive may be independently between 2% to 99% (e.g., 2% ofconductive additive 1 and 3% of conductive additive 2). In someembodiments, the coating comprises a percentage by weight of theconductive additive of about 2% to about 99%. In some embodiments, thecoating comprises a percentage by weight of the conductive additive ofabout 2% to about 5%, about 2% to about 10%, about 2% to about 20%,about 2% to about 30%, about 2% to about 40%, about 2% to about 50%,about 2% to about 60%, about 2% to about 70%, about 2% to about 80%,about 2% to about 99%, about 5% to about 10%, about 5% to about 20%,about 5% to about 30%, about 5% to about 40%, about 5% to about 50%,about 5% to about 60%, about 5% to about 70%, about 5% to about 80%,about 5% to about 99%, about 10% to about 20%, about 10% to about 30%,about 10% to about 40%, about 10% to about 50%, about 10% to about 60%,about 10% to about 70%, about 10% to about 80%, about 10% to about 99%,about 20% to about 30%, about 20% to about 40%, about 20% to about 50%,about 20% to about 60%, about 20% to about 70%, about 20% to about 80%,about 20% to about 99%, about 30% to about 40%, about 30% to about 50%,about 30% to about 60%, about 30% to about 70%, about 30% to about 80%,about 30% to about 99%, about 40% to about 50%, about 40% to about 60%,about 40% to about 70%, about 40% to about 80%, about 40% to about 99%,about 50% to about 60%, about 50% to about 70%, about 50% to about 80%,about 50% to about 99%, about 60% to about 70%, about 60% to about 80%,about 60% to about 99%, about 70% to about 80%, about 70% to about 99%,or about 80% to about 99%. In some embodiments, the coating comprises apercentage by weight of the conductive additive of about 2%, about 5%,about 10%, about 20%, about 30%, about 40%, about 50%, about 60%, about70%, about 80%, or about 99%. In some embodiments, the coating comprisesa percentage by weight of the conductive additive of at least about 2%,about 5%, about 10%, about 20%, about 30%, about 40%, about 50%, about60%, about 70%, or about 80%. In some embodiments, the coating comprisesa percentage by weight of the conductive additive of at most about 5%,about 10%, about 20%, about 30%, about 40%, about 50%, about 60%, about70%, about 80%, or about 99%.

In some embodiments, the coating comprises a percentage by weight of thebinder of about 2% to about 90%. In some embodiments, the coatingcomprises a percentage by weight of the binder of about 2% to about 5%,about 2% to about 10%, about 2% to about 20%, about 2% to about 30%,about 2% to about 40%, about 2% to about 50%, about 2% to about 60%,about 2% to about 70%, about 2% to about 80%, about 2% to about 90%,about 5% to about 10%, about 5% to about 20%, about 5% to about 30%,about 5% to about 40%, about 5% to about 50%, about 5% to about 60%,about 5% to about 70%, about 5% to about 80%, about 5% to about 90%,about 10% to about 20%, about 10% to about 30%, about 10% to about 40%,about 10% to about 50%, about 10% to about 60%, about 10% to about 70%,about 10% to about 80%, about 10% to about 90%, about 20% to about 30%,about 20% to about 40%, about 20% to about 50%, about 20% to about 60%,about 20% to about 70%, about 20% to about 80%, about 20% to about 90%,about 30% to about 40%, about 30% to about 50%, about 30% to about 60%,about 30% to about 70%, about 30% to about 80%, about 30% to about 90%,about 40% to about 50%, about 40% to about 60%, about 40% to about 70%,about 40% to about 80%, about 40% to about 90%, about 50% to about 60%,about 50% to about 70%, about 50% to about 80%, about 50% to about 90%,about 60% to about 70%, about 60% to about 80%, about 60% to about 90%,about 70% to about 80%, about 70% to about 90%, or about 80% to about90%. In some embodiments, the coating comprises a percentage by weightof the binder of about 2%, about 5%, about 10%, about 20%, about 30%,about 40%, about 50%, about 60%, about 70%, about 80%, or about 90%. Insome embodiments, the coating comprises a percentage by weight of thebinder of at least about 2%, about 5%, about 10%, about 20%, about 30%,about 40%, about 50%, about 60%, about 70%, or about 80%. In someembodiments, the coating comprises a percentage by weight of the binderof at most about 5%, about 10%, about 20%, about 30%, about 40%, about50%, about 60%, about 70%, about 80%, or about 90%.

In some embodiments, the coating comprises a percentage by weight of thesolvent of about 40% to about 90%. In some embodiments, the coatingcomprises a percentage by weight of the solvent of at least about 40%,about 45%, about 50%, about 55%, about 60%, about 65%, about 70%, about75%, about 80%, or about 85%. In some embodiments, the coating comprisesa percentage by weight of the solvent of at most about 45%, about 50%,about 55%, about 60%, about 65%, about 70%, about 75%, about 80%, about85%, or about 90%.

In some embodiments, the coating comprises a percentage by weight of thesurfactant of about 0.01% to about 10%. In some embodiments, the coatingcomprises a percentage by weight of the surfactant of at least about0.01%, about 0.05%, about 0.1%, about 0.5%, about 1%, about 2%, about3%, about 4%, about 5%, about 6%, or about 8%. In some embodiments, thecoating comprises a percentage by weight of the surfactant of at mostabout 0.05%, about 0.1%, about 0.5%, about 1%, about 2%, about 3%, about4%, about 5%, about 6%, about 8%, or about 10%.

In some embodiments, the coating comprises a percentage by weight of thedefoamer of about 0.1% to about 5%. In some embodiments, the coatingcomprises a percentage by weight of the defoamer of at least about 0.1%,about 0.25%, about 0.5%, about 0.75%, about 1%, about 2%, about 3%, orabout 4%. In some embodiments, the coating comprises a percentage byweight of the defoamer of at most about 0.25%, about 0.5%, about 0.75%,about 1%, about 2%, about 3%, about 4%, or about 5%.

In some embodiments, the coating has a solid content by weight of about20% to about 90%. In some embodiments, the coating has a solid contentby weight of about 40% to about 45%. In some embodiments, the coatinghas a solid content by weight of at least about 20%, 30%, 40%, 50%, 60%,70%, or 80%, including increments therein. In some embodiments, thecoating has a solid content by weight of at most about 30%, 40%, 50%,60%, 70%, 80%, or 90% including increments therein.

In some embodiments, the coating has a viscosity of about 1,000 MPa/s toabout 5,000 MPa/s. In some embodiments, the coating has a viscosity ofabout 1,000 MPa/s to about 1,500 MPa/s, about 1,000 MPa/s to about 2,000MPa/s, about 1,000 MPa/s to about 2,500 MPa/s, about 1,000 MPa/s toabout 3,000 MPa/s, about 1,000 MPa/s to about 3,500 MPa/s, about 1,000MPa/s to about 4,000 MPa/s, about 1,000 MPa/s to about 4,500 MPa/s,about 1,000 MPa/s to about 5,000 MPa/s, about 1,500 MPa/s to about 2,000MPa/s, about 1,500 MPa/s to about 2,500 MPa/s, about 1,500 MPa/s toabout 3,000 MPa/s, about 1,500 MPa/s to about 3,500 MPa/s, about 1,500MPa/s to about 4,000 MPa/s, about 1,500 MPa/s to about 4,500 MPa/s,about 1,500 MPa/s to about 5,000 MPa/s, about 2,000 MPa/s to about 2,500MPa/s, about 2,000 MPa/s to about 3,000 MPa/s, about 2,000 MPa/s toabout 3,500 MPa/s, about 2,000 MPa/s to about 4,000 MPa/s, about 2,000MPa/s to about 4,500 MPa/s, about 2,000 MPa/s to about 5,000 MPa/s,about 2,500 MPa/s to about 3,000 MPa/s, about 2,500 MPa/s to about 3,500MPa/s, about 2,500 MPa/s to about 4,000 MPa/s, about 2,500 MPa/s toabout 4,500 MPa/s, about 2,500 MPa/s to about 5,000 MPa/s, about 3,000MPa/s to about 3,500 MPa/s, about 3,000 MPa/s to about 4,000 MPa/s,about 3,000 MPa/s to about 4,500 MPa/s, about 3,000 MPa/s to about 5,000MPa/s, about 3,500 MPa/s to about 4,000 MPa/s, about 3,500 MPa/s toabout 4,500 MPa/s, about 3,500 MPa/s to about 5,000 MPa/s, about 4,000MPa/s to about 4,500 MPa/s, about 4,000 MPa/s to about 5,000 MPa/s, orabout 4,500 MPa/s to about 5,000 MPa/s, including increments therein. Insome embodiments, the coating has a viscosity of about 1,000 MPa/s,about 1,500 MPa/s, about 2,000 MPa/s, about 2,500 MPa/s, about 3,000MPa/s, about 3,500 MPa/s, about 4,000 MPa/s, about 4,500 MPa/s, or about5,000 MPa/s. In some embodiments, the coating has a viscosity of atleast about 1,000 MPa/s, about 1,500 MPa/s, about 2,000 MPa/s, about2,500 MPa/s, about 3,000 MPa/s, about 3,500 MPa/s, about 4,000 MPa/s, orabout 4,500 MPa/s. In some embodiments, the coating has a viscosity ofat most about 1,500 MPa/s, about 2,000 MPa/s, about 2,500 MPa/s, about3,000 MPa/s, about 3,500 MPa/s, about 4,000 MPa/s, about 4,500 MPa/s, orabout 5,000 MPa/s. In some embodiments, the viscosity of the coatingsherein enable their application to a wide variety of substrates andsurfaces of different materials and shapes. In some embodiments, theviscosity of the coatings herein enable their application to a substratethrough various coating means.

In some embodiments, the electromagnetic coating has a thermalconductivity when dry of about 1 W/mK to about 5 W/mK. In someembodiments, the electromagnetic coating has a thermal conductivity whendry of at least about 1 W/mK, 1.5 W/mK, 2 W/mK, 2.5 W/mK, 3 W/mK, 3.5W/mK, 4 W/mK, or 4.5 W/mK, including increments therein. In someembodiments, the conductive additives, binders, or both herein enablethe high thermal conductivity of the coating. In some embodiments,higher thermal conductivities enable the coating herein to draw moreheat away from devices creating heat and neighboring heat sensitiveelements, improving the functionality of all such heat sensitiveelements.

Methods of Forming EMI Shields

Provided herein are methods of forming an electromagnetic shieldcomprising forming a coating comprising: a conductive additive; abinder; a solvent; a surfactant; and a defoamer; depositing the coatingon a substrate; and drying the coating on the substrate. In someembodiments, a set thickness of the coating is applied to the substrate.In some embodiments, a greater thickness of the coating applied to thesubstrate forms a shield with a greater electromagnetic shieldingperformance. FIGS. 2A-2C show images of examples of EMI shieldsconsistent with the present disclosure.

In some embodiments, drying the coating on the substrate occurs for aperiod of time of about 5 minutes to about 60 minutes. In someembodiments, drying the coating on the substrate occurs for a period oftime of at least about 5 minutes, 10 minutes, 20 minutes, 30 minutes, 40minutes, or 50 minutes, including increments therein. In someembodiments, drying the coating on the substrate occurs for a period oftime of at most about 10 minutes, 20 minutes, 30 minutes, 40 minutes, 50minutes, or 60 minutes, including increments therein. In someembodiments, the method of forming an electromagnetic shield furthercomprises depositing a second coat of the coating on a substrate; anddrying the second coat. In some embodiments, drying the second coatoccurs for a period of time of about 5 minutes to about 60 minutes. Insome embodiments, drying the second coat occurs for a period of time ofat least about 5 minutes, 10 minutes, 20 minutes, 30 minutes, 40minutes, or 50 minutes, including increments therein. In someembodiments, drying the second coat occurs for a period of time of atmost about 10 minutes, 20 minutes, 30 minutes, 40 minutes, 50 minutes,or 60 minutes, including increments therein.

In some embodiments, the conductive additive comprises a carbon-basedadditive. In some embodiments, the carbon-based additive comprises,graphite, graphene, reduced graphene, graphene oxide, reduced grapheneoxide, carbon black, cabot carbon, a carbon nanotube, a functionalizedcarbon nanotube, or any combination thereof. In some embodiments, thecarbon-based additive is reduced. In some embodiments, the carbon-basedadditive is porous. In some embodiments, the carbon-based additivecomprises nanoplatelets, nanofibers, nanotubes, nanoparticles, nanorods,nanowires, nanoflowers, nanoflakes, nanofibers, nanoplatelets,nanoribbons, nanocubes, bipyramids, nanodiscs, nanoplates,nanodendrites, nanoleaves, nanospheres, quantum spheres, quantum dots,nanosprings, nanosheets, or any combination thereof. In someembodiments, the carbon nanotube is a multi-walled nanotube, asingle-walled nanotube, or a combination thereof. In some embodiments,the functionalized carbon nanotube is functionalized with hydroxide,carboxylic acid, or both.

In some embodiments, the binder comprises a polymeric binder. In someembodiments, the polymeric binder comprises styrene butadiene rubber,polyvinylidene fluoride, polytetrafluoroethylene, polyvinyl pyrrolidone,ethyl cellulose, polyurethane, polyester, or any combination thereof.

In some embodiments, the solvent comprises a polar aprotic solvent, or apolar protic solvent. In some embodiments, the polar aprotic solventcomprises N-Methyl-2-pyrrolidone, or dichloromethane, tetrahydrofuran,ethyl acetate, acetone, dimethylformamide, acetonitrile, dimethylsulfoxide, propylene carbonate, or any combination thereof. In someembodiments, the polar protic solvent comprises water, formic acid,n-butanol, isopropanol, nitromethane, ethanol, methanol, acetic acid, orany combination thereof.

In some embodiments, the surfactant comprises an acid, a nonionicsurfactant, or any combination thereof. In some embodiments, the acidcomprises perfluorooctanoic acid, perfluorooctane sulfonate,perfluorohexane sulfonic acid, perfluorononanoic acid, perfluorodecanoicacid, or any combination thereof. In some embodiments, the nonionicsurfactant comprises polyethylene glycol alkyl ether, octaethyleneglycol monododecyl ether, pentaethylene glycol monododecyl ether,polypropylene glycol alkyl ether, glucoside alkyl ether, decylglucoside, lauryl glucoside, octyl glucoside, polyethylene glycoloctylphenyl ether, dodecyldimethylamine oxide, polyethylene glycolalkylphenyl ether, polyethylene glycol octylphenyl ether, Triton X-100,polyethylene glycol alkylphenyl ether, nonoxynol-9, glycerol alkyl esterpolysorbate, sorbitan alkyl ester, polyethoxylated tallow amine, Dynol604, Zonyl F5-300, or any combination thereof.

In some embodiments, the defoamer comprises an insoluble oil, asilicone, a glycol, a stearate, an organic solvent, Surfynol DF-1100,alkyl polyacrylate, or any combination thereof. In some embodiments, theinsoluble oil comprises mineral oil, vegetable oil, white oil, or anycombination thereof. In some embodiments, the silicone comprisespolydimethylsiloxane, silicone glycol, a fluorosilicone, or anycombination thereof. In some embodiments, the glycol comprisespolyethylene glycol, ethylene glycol, propylene glycol, or anycombination thereof. In some embodiments, the stearate comprises glycolstearate, stearin, or any combination thereof. In some embodiments, theorganic solvent comprises ethanol, isopropyl alcohol,N-methyl-2-pyrrolidone, cyclohexanone, terpineol,3-methoxy-3-methyl-1-butanol, 4-hydroxyl-4-methyl-pentan-2-one, methylisobutyl ketone, or any combination thereof.

In some embodiments, the viscosity modifier comprisesN-methyl-2-pyrrolidone, ethanol, isopropyl alcohol, cyclohexanone,terpineol 3-methoxy-3-methyl-1-butanol,4-hydroxyl-4-methyl-pentane-2-one, methyl isobutyl ketone, or anycombination thereof.

In some embodiments, the substrate comprises a plastic, a metal, aglass, a fabric, or any combination thereof. In some embodiments, themetal comprises copper, aluminum, steel, stainless steel, or anycombination thereof. In some embodiments, the plastic comprises athermoplastic. In some embodiments, the thermoplastic comprisespolyethylene terephthalate, polyglycolic acid, polylactic acid,polycaprolactone, polyhydroxyalkanoate, polyhydroxybutyrate,polyethylene adipate, polybutylene succinate,poly(3-hydroxybutyrate-co-3-hydroxyvalerate), polybutyleneterephthalate, polytrimethylene terephthalate, polyethylene naphthalate,or any combination thereof. In some embodiments, a set thickness of thecoating is deposited on the substrate. In some embodiments, the methoddoes not comprise depositing the coating on the substrate. In someembodiments, the method further comprises removing the dried coatingfrom the substrate.

In some embodiments, forming the coating comprises: mixing the coating;breaking down agglomerates in the coating; removing air bubbles from thecoating; or any combination thereof. In some embodiments, the mixing isperformed by an acoustic mixer, a planetary mixer, a powder mixer, orany combination thereof. In some embodiments, mixing the coating isperformed at a speed of about 25 rpm to about 200 rpm. In someembodiments, the breaking down of the agglomerates in the coating isperformed by a high shear mixer. In some embodiments, the high sheermixer rotates at a speed of about 1,000 rpm to about 4,000 rpm. In someembodiments, the removing of the air bubbles from the coating isperformed by a vacuum mixer. In some embodiments, depositing the coatingon the substrate comprises depositing the coating on the substrate witha coating machine, a doctor's blade, a table-top coater, an air sprayer,or any combination thereof. In some embodiments, the coating machine isa slot die coating machine. In some embodiments, depositing the coatingon the substrate comprises depositing the coating on at most a portionof the substrate. FIG. 15 shows an image of applying the coating to asubstrate. In some embodiments, the method further comprises calendaringthe electromagnetic shield. In some embodiments, calendaring isperformed by a roll to roll calendaring machine.

In some embodiments, drying the coating on the substrate comprisesdrying at a temperature of about 20° C. to about 120° C. In someembodiments, drying the coating on the substrate comprises drying at atemperature of about 20° C. to about 30° C., about 20° C. to about 40°C., about 20° C. to about 50° C., about 20° C. to about 60° C., about20° C. to about 70° C., about 20° C. to about 80° C., about 20° C. toabout 90° C., about 20° C. to about 100° C., about 20° C. to about 110°C., about 20° C. to about 120° C., about 30° C. to about 40° C., about30° C. to about 50° C., about 30° C. to about 60° C., about 30° C. toabout 70° C., about 30° C. to about 80° C., about 30° C. to about 90°C., about 30° C. to about 100° C., about 30° C. to about 110° C., about30° C. to about 120° C., about 40° C. to about 50° C., about 40° C. toabout 60° C., about 40° C. to about 70° C., about 40° C. to about 80°C., about 40° C. to about 90° C., about 40° C. to about 100° C., about40° C. to about 110° C., about 40° C. to about 120° C., about 50° C. toabout 60° C., about 50° C. to about 70° C., about 50° C. to about 80°C., about 50° C. to about 90° C., about 50° C. to about 100° C., about50° C. to about 110° C., about 50° C. to about 120° C., about 60° C. toabout 70° C., about 60° C. to about 80° C., about 60° C. to about 90°C., about 60° C. to about 100° C., about 60° C. to about 110° C., about60° C. to about 120° C., about 70° C. to about 80° C., about 70° C. toabout 90° C., about 70° C. to about 100° C., about 70° C. to about 110°C., about 70° C. to about 120° C., about 80° C. to about 90° C., about80° C. to about 100° C., about 80° C. to about 110° C., about 80° C. toabout 120° C., about 90° C. to about 100° C., about 90° C. to about 110°C., about 90° C. to about 120° C., about 100° C. to about 110° C., about100° C. to about 120° C., or about 110° C. to about 120° C. In someembodiments, drying the coating on the substrate comprises drying at atemperature of about 20° C., about 30° C., about 40° C., about 50° C.,about 60° C., about 70° C., about 80° C., about 90° C., about 100° C.,about 110° C., or about 120° C. In some embodiments, drying the coatingon the substrate comprises drying at a temperature of at least about 20°C., about 30° C., about 40° C., about 50° C., about 60° C., about 70°C., about 80° C., about 90° C., about 100° C., or about 110° C. In someembodiments, drying the coating on the substrate comprises drying at atemperature of at most about 30° C., about 40° C., about 50° C., about60° C., about 70° C., about 80° C., about 90° C., about 100° C., about110° C., or about 120° C.

In some embodiments, at least one of the breaking down of theagglomerates in the coating and the removing of the air bubbles from thecoating is performed until the coating has a viscosity of about 1,000MPa/s to about 5,000 MPa/s. In some embodiments, at least one of thebreaking down of the agglomerates in the coating and the removing of theair bubbles from the coating is performed until the coating has aviscosity of about 1,000 MPa/s to about 1,500 MPa/s, about 1,000 MPa/sto about 2,000 MPa/s, about 1,000 MPa/s to about 2,500 MPa/s, about1,000 MPa/s to about 3,000 MPa/s, about 1,000 MPa/s to about 3,500MPa/s, about 1,000 MPa/s to about 4,000 MPa/s, about 1,000 MPa/s toabout 4,500 MPa/s, about 1,000 MPa/s to about 5,000 MPa/s, about 1,500MPa/s to about 2,000 MPa/s, about 1,500 MPa/s to about 2,500 MPa/s,about 1,500 MPa/s to about 3,000 MPa/s, about 1,500 MPa/s to about 3,500MPa/s, about 1,500 MPa/s to about 4,000 MPa/s, about 1,500 MPa/s toabout 4,500 MPa/s, about 1,500 MPa/s to about 5,000 MPa/s, about 2,000MPa/s to about 2,500 MPa/s, about 2,000 MPa/s to about 3,000 MPa/s,about 2,000 MPa/s to about 3,500 MPa/s, about 2,000 MPa/s to about 4,000MPa/s, about 2,000 MPa/s to about 4,500 MPa/s, about 2,000 MPa/s toabout 5,000 MPa/s, about 2,500 MPa/s to about 3,000 MPa/s, about 2,500MPa/s to about 3,500 MPa/s, about 2,500 MPa/s to about 4,000 MPa/s,about 2,500 MPa/s to about 4,500 MPa/s, about 2,500 MPa/s to about 5,000MPa/s, about 3,000 MPa/s to about 3,500 MPa/s, about 3,000 MPa/s toabout 4,000 MPa/s, about 3,000 MPa/s to about 4,500 MPa/s, about 3,000MPa/s to about 5,000 MPa/s, about 3,500 MPa/s to about 4,000 MPa/s,about 3,500 MPa/s to about 4,500 MPa/s, about 3,500 MPa/s to about 5,000MPa/s, about 4,000 MPa/s to about 4,500 MPa/s, about 4,000 MPa/s toabout 5,000 MPa/s, or about 4,500 MPa/s to about 5,000 MPa/s, includingincrements therein. In some embodiments, at least one of the breakingdown of the agglomerates in the coating and the removing of the airbubbles from the coating is performed until the coating has a viscosityof about 1,000 MPa/s, about 1,500 MPa/s, about 2,000 MPa/s, about 2,500MPa/s, about 3,000 MPa/s, about 3,500 MPa/s, about 4,000 MPa/s, about4,500 MPa/s, or about 5,000 MPa/s. In some embodiments, at least one ofthe breaking down of the agglomerates in the coating and the removing ofthe air bubbles from the coating is performed until the coating has aviscosity of at least about 1,000 MPa/s, about 1,500 MPa/s, about 2,000MPa/s, about 2,500 MPa/s, about 3,000 MPa/s, about 3,500 MPa/s, about4,000 MPa/s, or about 4,500 MPa/s. In some embodiments, at least one ofthe breaking down of the agglomerates in the coating and the removing ofthe air bubbles from the coating is performed until the coating has aviscosity of at most about 1,500 MPa/s, about 2,000 MPa/s, about 2,500MPa/s, about 3,000 MPa/s, about 3,500 MPa/s, about 4,000 MPa/s, about4,500 MPa/s, or about 5,000 MPa/s.

In some embodiments, the coating has a viscosity of about 1,000 MPa/s toabout 5,000 MPa/s. In some embodiments, the coating has a viscosity ofabout 1,000 MPa/s to about 1,500 MPa/s, about 1,000 MPa/s to about 2,000MPa/s, about 1,000 MPa/s to about 2,500 MPa/s, about 1,000 MPa/s toabout 3,000 MPa/s, about 1,000 MPa/s to about 3,500 MPa/s, about 1,000MPa/s to about 4,000 MPa/s, about 1,000 MPa/s to about 4,500 MPa/s,about 1,000 MPa/s to about 5,000 MPa/s, about 1,500 MPa/s to about 2,000MPa/s, about 1,500 MPa/s to about 2,500 MPa/s, about 1,500 MPa/s toabout 3,000 MPa/s, about 1,500 MPa/s to about 3,500 MPa/s, about 1,500MPa/s to about 4,000 MPa/s, about 1,500 MPa/s to about 4,500 MPa/s,about 1,500 MPa/s to about 5,000 MPa/s, about 2,000 MPa/s to about 2,500MPa/s, about 2,000 MPa/s to about 3,000 MPa/s, about 2,000 MPa/s toabout 3,500 MPa/s, about 2,000 MPa/s to about 4,000 MPa/s, about 2,000MPa/s to about 4,500 MPa/s, about 2,000 MPa/s to about 5,000 MPa/s,about 2,500 MPa/s to about 3,000 MPa/s, about 2,500 MPa/s to about 3,500MPa/s, about 2,500 MPa/s to about 4,000 MPa/s, about 2,500 MPa/s toabout 4,500 MPa/s, about 2,500 MPa/s to about 5,000 MPa/s, about 3,000MPa/s to about 3,500 MPa/s, about 3,000 MPa/s to about 4,000 MPa/s,about 3,000 MPa/s to about 4,500 MPa/s, about 3,000 MPa/s to about 5,000MPa/s, about 3,500 MPa/s to about 4,000 MPa/s, about 3,500 MPa/s toabout 4,500 MPa/s, about 3,500 MPa/s to about 5,000 MPa/s, about 4,000MPa/s to about 4,500 MPa/s, about 4,000 MPa/s to about 5,000 MPa/s, orabout 4,500 MPa/s to about 5,000 MPa/s, including increments therein. Insome embodiments, the coating has a viscosity of about 1,000 MPa/s,about 1,500 MPa/s, about 2,000 MPa/s, about 2,500 MPa/s, about 3,000MPa/s, about 3,500 MPa/s, about 4,000 MPa/s, about 4,500 MPa/s, or about5,000 MPa/s. In some embodiments, the coating has a viscosity of atleast about 1,000 MPa/s, about 1,500 MPa/s, about 2,000 MPa/s, about2,500 MPa/s, about 3,000 MPa/s, about 3,500 MPa/s, about 4,000 MPa/s, orabout 4,500 MPa/s. In some embodiments, the coating has a viscosity ofat most about 1,500 MPa/s, about 2,000 MPa/s, about 2,500 MPa/s, about3,000 MPa/s, about 3,500 MPa/s, about 4,000 MPa/s, about 4,500 MPa/s, orabout 5,000 MPa/s.

EMI Shield Effectiveness Testing

Although various apparatuses or methods known to one of skill in the artcan be employed to test the Electromagnetic Interference (EMI) shieldeffectiveness of a sample 610, FIG. 6 shows a diagram of an EMI shieldeffectiveness testing apparatus 600. As shown the apparatus 600comprises a transmitting antenna 621 and a receiving antenna 622 thatare separated by the EMI shielding sample 610. Further as shown, thetransmitting antenna 621 emits an unattenuated signal 631, whereas theEMI shielding sample 610 blocks all but an attenuated signal 632 fromreaching the receiving antenna 622. The shielding effectiveness of theEMI shielding sample 610 can be determined as the difference between thepower of the unattenuated signal 631 and the attenuated signal 632.

In some embodiments, per FIG. 6 , the transmitting antenna 621 iscontained within a first shielded enclosure 641 and the receivingantenna 622 is contained with a second shielded enclosure 642.Alternatively, in some embodiments, only the transmitting antenna 621 iscontained within the first shielded enclosure 641, whereas the receivingantenna 622 is not contained with the second shielded enclosure 642.Alternatively, in some embodiments, only the receiving antenna 622 iscontained with the second shielded enclosure 642, wherein thetransmitting antenna 621 is not contained within the first shieldedenclosure 641.

In some embodiments, the transmitting antenna 621 receives theunattenuated signal 631 from a signal generator. In some embodiments,the transmitting antenna 621 receives the unattenuated signal 631 from apower amplifier receiving the unattenuated signal 631 from the signalgenerator. In some embodiments, the receiving antenna 622 transmits theattenuated signal 632 to a spectrum analyzer, a signal analyzer, or anycombination thereof.

In some embodiments, the transmitting antenna 621 and the receivingantenna 622 are aligned such that the unattenuated signal 631 and theattenuated signal 632 are both perpendicular to the EMI shielding sample610. In some embodiments, the transmitting antenna 621 and the receivingantenna 622 are aligned such that the unattenuated signal 631 and theattenuated signal 632 are emitted at the center of the EMI shieldingsample 610. In some embodiments, the transmitting antenna 621 isseparated from the EMI shielding sample 610 by about 50 cm. In someembodiments, the receiving antenna 622 is separated from the EMIshielding sample 610 by about 50 cm. In some embodiments, thetransmitting antenna 621 and the receiving are separated from each otherby about 100 cm.

FIGS. 7A-B shows images of a transmission portion of an EMI shieldeffectiveness testing setup. FIGS. 8A-B shows images of a receptionportion of an EMI shield effectiveness testing setup.

EMI Shielding Performance

In some embodiments, the electromagnetic shield has a conductivity ofabout 10 S/m to about 10,000 S/m. In some embodiments, theelectromagnetic shield has a conductivity of about 10 S/m to about 20S/m, about 10 S/m to about 50 S/m, about 10 S/m to about 100 S/m, about10 S/m to about 200 S/m, about 10 S/m to about 500 S/m, about 10 S/m toabout 1,000 S/m, about 10 S/m to about 2,000 S/m, about 10 S/m to about5,000 S/m, about 10 S/m to about 10,000 S/m, about 10 S/m to about 2,000S/m, about 20 S/m to about 50 S/m, about 20 S/m to about 100 S/m, about20 S/m to about 200 S/m, about 20 S/m to about 500 S/m, about 20 S/m toabout 1,000 S/m, about 20 S/m to about 2,000 S/m, about 20 S/m to about5,000 S/m, about 20 S/m to about 10,000 S/m, about 20 S/m to about 2,000S/m, about 50 S/m to about 100 S/m, about 50 S/m to about 200 S/m, about50 S/m to about 500 S/m, about 50 S/m to about 1,000 S/m, about 50 S/mto about 2,000 S/m, about 50 S/m to about 5,000 S/m, about 50 S/m toabout 10,000 S/m, about 50 S/m to about 2,000 S/m, about 100 S/m toabout 200 S/m, about 100 S/m to about 500 S/m, about 100 S/m to about1,000 S/m, about 100 S/m to about 2,000 S/m, about 100 S/m to about5,000 S/m, about 100 S/m to about 10,000 S/m, about 100 S/m to about2,000 S/m, about 200 S/m to about 500 S/m, about 200 S/m to about 1,000S/m, about 200 S/m to about 2,000 S/m, about 200 S/m to about 5,000 S/m,about 200 S/m to about 10,000 S/m, about 200 S/m to about 2,000 S/m,about 500 S/m to about 1,000 S/m, about 500 S/m to about 2,000 S/m,about 500 S/m to about 5,000 S/m, about 500 S/m to about 10,000 S/m,about 500 S/m to about 2,000 S/m, about 1,000 S/m to about 2,000 S/m,about 1,000 S/m to about 5,000 S/m, about 1,000 S/m to about 10,000 S/m,about 1,000 S/m to about 2,000 S/m, about 2,000 S/m to about 5,000 S/m,about 2,000 S/m to about 10,000 S/m, about 2,000 S/m to about 2,000 S/m,about 5,000 S/m to about 10,000 S/m, about 5,000 S/m to about 2,000 S/m,or about 10,000 S/m to about 2,000 S/m. In some embodiments, theelectromagnetic shield has a conductivity of about 10 S/m, about 20 S/m,about 50 S/m, about 100 S/m, about 200 S/m, about 500 S/m, about 1,000S/m, about 2,000 S/m, about 5,000 S/m, about 10,000 S/m, or about 2,000S/m. In some embodiments, the electromagnetic shield has a conductivityof at least about 10 S/m, about 20 S/m, about 50 S/m, about 100 S/m,about 200 S/m, about 500 S/m, about 1,000 S/m, about 2,000 S/m, about5,000 S/m, or about 10,000 S/m. In some embodiments, the electromagneticshield has a conductivity of at most about 20 S/m, about 50 S/m, about100 S/m, about 200 S/m, about 500 S/m, about 1,000 S/m, about 2,000 S/m,about 5,000 S/m, about 10,000 S/m, or about 2,000 S/m.

In some embodiments, the electromagnetic shield has a sheet resistanceof about 0.1 ohm/sq to about 1,000 ohm/sq. In some embodiments, theelectromagnetic shield has a sheet resistance of about 0.1 ohm/sq toabout 0.2 ohm/sq, about 0.1 ohm/sq to about 0.5 ohm/sq, about 0.1 ohm/sqto about 1 ohm/sq, about 0.1 ohm/sq to about 5 ohm/sq, about 0.1 ohm/sqto about 10 ohm/sq, about 0.1 ohm/sq to about 50 ohm/sq, about 0.1ohm/sq to about 100 ohm/sq, about 0.1 ohm/sq to about 500 ohm/sq, about0.1 ohm/sq to about 1,000 ohm/sq, about 0.2 ohm/sq to about 0.5 ohm/sq,about 0.2 ohm/sq to about 1 ohm/sq, about 0.2 ohm/sq to about 5 ohm/sq,about 0.2 ohm/sq to about 10 ohm/sq, about 0.2 ohm/sq to about 50ohm/sq, about 0.2 ohm/sq to about 100 ohm/sq, about 0.2 ohm/sq to about500 ohm/sq, about 0.2 ohm/sq to about 1,000 ohm/sq, about 0.5 ohm/sq toabout 1 ohm/sq, about 0.5 ohm/sq to about 5 ohm/sq, about 0.5 ohm/sq toabout 10 ohm/sq, about 0.5 ohm/sq to about 50 ohm/sq, about 0.5 ohm/sqto about 100 ohm/sq, about 0.5 ohm/sq to about 500 ohm/sq, about 0.5ohm/sq to about 1,000 ohm/sq, about 1 ohm/sq to about 5 ohm/sq, about 1ohm/sq to about 10 ohm/sq, about 1 ohm/sq to about 50 ohm/sq, about 1ohm/sq to about 100 ohm/sq, about 1 ohm/sq to about 500 ohm/sq, about 1ohm/sq to about 1,000 ohm/sq, about 5 ohm/sq to about 10 ohm/sq, about 5ohm/sq to about 50 ohm/sq, about 5 ohm/sq to about 100 ohm/sq, about 5ohm/sq to about 500 ohm/sq, about 5 ohm/sq to about 1,000 ohm/sq, about10 ohm/sq to about 50 ohm/sq, about 10 ohm/sq to about 100 ohm/sq, about10 ohm/sq to about 500 ohm/sq, about 10 ohm/sq to about 1,000 ohm/sq,about 50 ohm/sq to about 100 ohm/sq, about 50 ohm/sq to about 500ohm/sq, about 50 ohm/sq to about 1,000 ohm/sq, about 100 ohm/sq to about500 ohm/sq, about 100 ohm/sq to about 1,000 ohm/sq, or about 500 ohm/sqto about 1,000 ohm/sq. In some embodiments, the electromagnetic shieldhas a sheet resistance of about 0.1 ohm/sq, about 0.2 ohm/sq, about 0.5ohm/sq, about 1 ohm/sq, about 5 ohm/sq, about 10 ohm/sq, about 50ohm/sq, about 100 ohm/sq, about 500 ohm/sq, or about 1,000 ohm/sq. Insome embodiments, the electromagnetic shield has a sheet resistance ofat least about 0.1 ohm/sq, about 0.2 ohm/sq, about 0.5 ohm/sq, about 1ohm/sq, about 5 ohm/sq, about 10 ohm/sq, about 50 ohm/sq, about 100ohm/sq, or about 500 ohm/sq. In some embodiments, the electromagneticshield has a sheet resistance of at most about 0.2 ohm/sq, about 0.5ohm/sq, about 1 ohm/sq, about 5 ohm/sq, about 10 ohm/sq, about 50ohm/sq, about 100 ohm/sq, about 500 ohm/sq, or about 1,000 ohm/sq.

In some embodiments, the electromagnetic shield has an operatingtemperature of about 0° C. to about 400° C. In some embodiments, theelectromagnetic shield has an operating temperature of about 0° C. toabout 10° C., about 0° C. to about 20° C., about 0° C. to about 50° C.,about 0° C. to about 100° C., about 0° C. to about 150° C., about 0° C.to about 200° C., about 0° C. to about 250° C., about 0° C. to about300° C., about 0° C. to about 350° C., about 0° C. to about 400° C.,about 10° C. to about 20° C., about 10° C. to about 50° C., about 10° C.to about 100° C., about 10° C. to about 150° C., about 10° C. to about200° C., about 10° C. to about 250° C., about 10° C. to about 300° C.,about 10° C. to about 350° C., about 10° C. to about 400° C., about 20°C. to about 50° C., about 20° C. to about 100° C., about 20° C. to about150° C., about 20° C. to about 200° C., about 20° C. to about 250° C.,about 20° C. to about 300° C., about 20° C. to about 350° C., about 20°C. to about 400° C., about 50° C. to about 100° C., about 50° C. toabout 150° C., about 50° C. to about 200° C., about 50° C. to about 250°C., about 50° C. to about 300° C., about 50° C. to about 350° C., about50° C. to about 400° C., about 100° C. to about 150° C., about 100° C.to about 200° C., about 100° C. to about 250° C., about 100° C. to about300° C., about 100° C. to about 350° C., about 100° C. to about 400° C.,about 150° C. to about 200° C., about 150° C. to about 250° C., about150° C. to about 300° C., about 150° C. to about 350° C., about 150° C.to about 400° C., about 200° C. to about 250° C., about 200° C. to about300° C., about 200° C. to about 350° C., about 200° C. to about 400° C.,about 250° C. to about 300° C., about 250° C. to about 350° C., about250° C. to about 400° C., about 300° C. to about 350° C., about 300° C.to about 400° C., or about 350° C. to about 400° C. In some embodiments,the electromagnetic shield has an operating temperature of about 0° C.,about 10° C., about 20° C., about 50° C., about 100° C., about 150° C.,about 200° C., about 250° C., about 300° C., about 350° C., or about400° C. In some embodiments, the electromagnetic shield has an operatingtemperature of at least about 0° C., about 10° C., about 20° C., about50° C., about 100° C., about 150° C., about 200° C., about 250° C.,about 300° C., or about 350° C. In some embodiments, the electromagneticshield has an operating temperature of at most about 10° C., about 20°C., about 50° C., about 100° C., about 150° C., about 200° C., about250° C., about 300° C., about 350° C., or about 400° C.

In some embodiments, the electromagnetic shield with a film thickness ofless than 100 μm has a shielding effectiveness in the frequency range ofabout 10 kHz to about 40 MHz of about 20 dB to about 40 dB. In someembodiments, the electromagnetic shield with a film thickness of lessthan 100 μm has a shielding effectiveness in the frequency range ofabout 10 kHz to about 40 MHz of about 20 dB to about 22 dB, about 20 dBto about 24 dB, about 20 dB to about 26 dB, about 20 dB to about 28 dB,about 20 dB to about 30 dB, about 20 dB to about 32 dB, about 20 dB toabout 34 dB, about 20 dB to about 36 dB, about 20 dB to about 38 dB,about 20 dB to about 40 dB, about 22 dB to about 24 dB, about 22 dB toabout 26 dB, about 22 dB to about 28 dB, about 22 dB to about 30 dB,about 22 dB to about 32 dB, about 22 dB to about 34 dB, about 22 dB toabout 36 dB, about 22 dB to about 38 dB, about 22 dB to about 40 dB,about 24 dB to about 26 dB, about 24 dB to about 28 dB, about 24 dB toabout 30 dB, about 24 dB to about 32 dB, about 24 dB to about 34 dB,about 24 dB to about 36 dB, about 24 dB to about 38 dB, about 24 dB toabout 40 dB, about 26 dB to about 28 dB, about 26 dB to about 30 dB,about 26 dB to about 32 dB, about 26 dB to about 34 dB, about 26 dB toabout 36 dB, about 26 dB to about 38 dB, about 26 dB to about 40 dB,about 28 dB to about 30 dB, about 28 dB to about 32 dB, about 28 dB toabout 34 dB, about 28 dB to about 36 dB, about 28 dB to about 38 dB,about 28 dB to about 40 dB, about 30 dB to about 32 dB, about 30 dB toabout 34 dB, about 30 dB to about 36 dB, about 30 dB to about 38 dB,about 30 dB to about 40 dB, about 32 dB to about 34 dB, about 32 dB toabout 36 dB, about 32 dB to about 38 dB, about 32 dB to about 40 dB,about 34 dB to about 36 dB, about 34 dB to about 38 dB, about 34 dB toabout 40 dB, about 36 dB to about 38 dB, about 36 dB to about 40 dB, orabout 38 dB to about 40 dB. In some embodiments, the electromagneticshield with a film thickness of less than 100 μm has a shieldingeffectiveness in the frequency range of about 10 kHz to about 40 MHz ofabout 20 dB, about 22 dB, about 24 dB, about 26 dB, about 28 dB, about30 dB, about 32 dB, about 34 dB, about 36 dB, about 38 dB, or about 40dB. In some embodiments, the electromagnetic shield with a filmthickness of less than 100 μm has a shielding effectiveness in thefrequency range of about 10 kHz to about 40 MHz of at least about 20 dB,about 22 dB, about 24 dB, about 26 dB, about 28 dB, about 30 dB, about32 dB, about 34 dB, about 36 dB, or about 38 dB. In some embodiments,the electromagnetic shield with a film thickness of less than 100 μm hasa shielding effectiveness in the frequency range of about 10 kHz toabout 40 MHz of at most about 22 dB, about 24 dB, about 26 dB, about 28dB, about 30 dB, about 32 dB, about 34 dB, about 36 dB, about 38 dB, orabout 40 dB.

In some embodiments, the electromagnetic shield with a film thickness ofless than 100 μm has a shielding effectiveness in the frequency range ofabout of about 1 GHz to about 40 GHz of about 40 dB to about 70 dB. Insome embodiments, the electromagnetic shield with a film thickness ofless than 100 μm has a shielding effectiveness in the frequency range ofabout of about 1 GHz to about 40 GHz of about 40 dB to about 45 dB,about 40 dB to about 50 dB, about 40 dB to about 55 dB, about 40 dB toabout 60 dB, about 40 dB to about 65 dB, about 40 dB to about 70 dB,about 45 dB to about 50 dB, about 45 dB to about 55 dB, about 45 dB toabout 60 dB, about 45 dB to about 65 dB, about 45 dB to about 70 dB,about 50 dB to about 55 dB, about 50 dB to about 60 dB, about 50 dB toabout 65 dB, about 50 dB to about 70 dB, about 55 dB to about 60 dB,about 55 dB to about 65 dB, about 55 dB to about 70 dB, about 60 dB toabout 65 dB, about 60 dB to about 70 dB, or about 65 dB to about 70 dB.In some embodiments, the electromagnetic shield with a film thickness ofless than 100 μm has a shielding effectiveness in the frequency range ofabout of about 1 GHz to about 40 GHz of about 40 dB, about 45 dB, about50 dB, about 55 dB, about 60 dB, about 65 dB, or about 70 dB. In someembodiments, the electromagnetic shield with a film thickness of lessthan 100 μm has a shielding effectiveness in the frequency range ofabout of about 1 GHz to about 40 GHz of at least about 40 dB, about 45dB, about 50 dB, about 55 dB, about 60 dB, or about 65 dB. In someembodiments, the electromagnetic shield with a film thickness of lessthan 100 μm has a shielding effectiveness in the frequency range ofabout of about 1 GHz to about 40 GHz of at most about 45 dB, about 50dB, about 55 dB, about 60 dB, about 65 dB, or about 70 dB.

In some embodiments, the electromagnetic shield with a film thickness ofless than 100 μm has a shielding effectiveness in the frequency range ofabout of 10 kHz to about 30 kHz of about 5 dB to about 40 dB. In someembodiments, the electromagnetic shield with a film thickness of lessthan 100 μm has a shielding effectiveness in the frequency range ofabout of 10 kHz to about 30 kHz of about 5 dB to about 10 dB, about 5 dBto about 15 dB, about 5 dB to about 20 dB, about 5 dB to about 25 dB,about 5 dB to about 30 dB, about 5 dB to about 35 dB, about 5 dB toabout 40 dB, about 10 dB to about 15 dB, about 10 dB to about 20 dB,about 10 dB to about 25 dB, about 10 dB to about 30 dB, about 10 dB toabout 35 dB, about 10 dB to about 40 dB, about 15 dB to about 20 dB,about 15 dB to about 25 dB, about 15 dB to about 30 dB, about 15 dB toabout 35 dB, about 15 dB to about 40 dB, about 20 dB to about 25 dB,about 20 dB to about 30 dB, about 20 dB to about 35 dB, about 20 dB toabout 40 dB, about 25 dB to about 30 dB, about 25 dB to about 35 dB,about 25 dB to about 40 dB, about 30 dB to about 35 dB, about 30 dB toabout 40 dB, or about 35 dB to about 40 dB. In some embodiments, theelectromagnetic shield with a film thickness of less than 100 μm has ashielding effectiveness in the frequency range of about of 10 kHz toabout 30 kHz of about 5 dB, about 10 dB, about 15 dB, about 20 dB, about25 dB, about 30 dB, about 35 dB, or about 40 dB. In some embodiments,the electromagnetic shield with a film thickness of less than 100 μm hasa shielding effectiveness in the frequency range of about of 10 kHz toabout 30 kHz of at least about 5 dB, about 10 dB, about 15 dB, about 20dB, about 25 dB, about 30 dB, or about 35 dB. In some embodiments, theelectromagnetic shield with a film thickness of less than 100 μm has ashielding effectiveness in the frequency range of about of 10 kHz toabout 30 kHz of at most about 10 dB, about 15 dB, about 20 dB, about 25dB, about 30 dB, about 35 dB, or about 40 dB.

In some embodiments, the electromagnetic shield with a film thickness ofless than 100 μm has a shielding effectiveness in the frequency range ofabout of about 40 kHz to about 100 MHz of about 1 dB to about 100 dB. Insome embodiments, the electromagnetic shield with a film thickness ofless than 100 μm has a shielding effectiveness in the frequency range ofabout of about 40 kHz to about 100 MHz of about 1 dB to about 5 dB,about 1 dB to about 10 dB, about 1 dB to about 20 dB, about 1 dB toabout 30 dB, about 1 dB to about 40 dB, about 1 dB to about 50 dB, about1 dB to about 60 dB, about 1 dB to about 70 dB, about 1 dB to about 80dB, about 1 dB to about 90 dB, about 1 dB to about 100 dB, about 5 dB toabout 10 dB, about 5 dB to about 20 dB, about 5 dB to about 30 dB, about5 dB to about 40 dB, about 5 dB to about 50 dB, about 5 dB to about 60dB, about 5 dB to about 70 dB, about 5 dB to about 80 dB, about 5 dB toabout 90 dB, about 5 dB to about 100 dB, about 10 dB to about 20 dB,about 10 dB to about 30 dB, about 10 dB to about 40 dB, about 10 dB toabout 50 dB, about 10 dB to about 60 dB, about 10 dB to about 70 dB,about 10 dB to about 80 dB, about 10 dB to about 90 dB, about 10 dB toabout 100 dB, about 20 dB to about 30 dB, about 20 dB to about 40 dB,about 20 dB to about 50 dB, about 20 dB to about 60 dB, about 20 dB toabout 70 dB, about 20 dB to about 80 dB, about 20 dB to about 90 dB,about 20 dB to about 100 dB, about 30 dB to about 40 dB, about 30 dB toabout 50 dB, about 30 dB to about 60 dB, about 30 dB to about 70 dB,about 30 dB to about 80 dB, about 30 dB to about 90 dB, about 30 dB toabout 100 dB, about 40 dB to about 50 dB, about 40 dB to about 60 dB,about 40 dB to about 70 dB, about 40 dB to about 80 dB, about 40 dB toabout 90 dB, about 40 dB to about 100 dB, about 50 dB to about 60 dB,about 50 dB to about 70 dB, about 50 dB to about 80 dB, about 50 dB toabout 90 dB, about 50 dB to about 100 dB, about 60 dB to about 70 dB,about 60 dB to about 80 dB, about 60 dB to about 90 dB, about 60 dB toabout 100 dB, about 70 dB to about 80 dB, about 70 dB to about 90 dB,about 70 dB to about 100 dB, about 80 dB to about 90 dB, about 80 dB toabout 100 dB, or about 90 dB to about 100 dB. In some embodiments, theelectromagnetic shield with a film thickness of less than 100 μm has ashielding effectiveness in the frequency range of about of about 40 kHzto about 100 MHz of about 1 dB, about 5 dB, about 10 dB, about 20 dB,about 30 dB, about 40 dB, about 50 dB, about 60 dB, about 70 dB, about80 dB, about 90 dB, or about 100 dB. In some embodiments, theelectromagnetic shield with a film thickness of less than 100 μm has ashielding effectiveness in the frequency range of about of about 40 kHzto about 100 MHz of at least about 1 dB, about 5 dB, about 10 dB, about20 dB, about 30 dB, about 40 dB, about 50 dB, about 60 dB, about 70 dB,about 80 dB, or about 90 dB. In some embodiments, the electromagneticshield with a film thickness of less than 100 μm has a shieldingeffectiveness in the frequency range of about of about 40 kHz to about100 MHz of at most about 5 dB, about 10 dB, about 20 dB, about 30 dB,about 40 dB, about 50 dB, about 60 dB, about 70 dB, about 80 dB, about90 dB, or about 100 dB.

In some embodiments, the electromagnetic shield with a film thickness ofless than 100 μm has a shielding effectiveness in the frequency range ofabout of 200 MHz to about 1 GHz of about 1 dB to about 100 dB. In someembodiments, the electromagnetic shield with a film thickness of lessthan 100 μm has a shielding effectiveness in the frequency range ofabout of 200 MHz to about 1 GHz of about 1 dB to about 5 dB, about 1 dBto about 10 dB, about 1 dB to about 20 dB, about 1 dB to about 30 dB,about 1 dB to about 40 dB, about 1 dB to about 50 dB, about 1 dB toabout 60 dB, about 1 dB to about 70 dB, about 1 dB to about 80 dB, about1 dB to about 90 dB, about 1 dB to about 100 dB, about 5 dB to about 10dB, about 5 dB to about 20 dB, about 5 dB to about 30 dB, about 5 dB toabout 40 dB, about 5 dB to about 50 dB, about 5 dB to about 60 dB, about5 dB to about 70 dB, about 5 dB to about 80 dB, about 5 dB to about 90dB, about 5 dB to about 100 dB, about 10 dB to about 20 dB, about 10 dBto about 30 dB, about 10 dB to about 40 dB, about 10 dB to about 50 dB,about 10 dB to about 60 dB, about 10 dB to about 70 dB, about 10 dB toabout 80 dB, about 10 dB to about 90 dB, about 10 dB to about 100 dB,about 20 dB to about 30 dB, about 20 dB to about 40 dB, about 20 dB toabout 50 dB, about 20 dB to about 60 dB, about 20 dB to about 70 dB,about 20 dB to about 80 dB, about 20 dB to about 90 dB, about 20 dB toabout 100 dB, about 30 dB to about 40 dB, about 30 dB to about 50 dB,about 30 dB to about 60 dB, about 30 dB to about 70 dB, about 30 dB toabout 80 dB, about 30 dB to about 90 dB, about 30 dB to about 100 dB,about 40 dB to about 50 dB, about 40 dB to about 60 dB, about 40 dB toabout 70 dB, about 40 dB to about 80 dB, about 40 dB to about 90 dB,about 40 dB to about 100 dB, about 50 dB to about 60 dB, about 50 dB toabout 70 dB, about 50 dB to about 80 dB, about 50 dB to about 90 dB,about 50 dB to about 100 dB, about 60 dB to about 70 dB, about 60 dB toabout 80 dB, about 60 dB to about 90 dB, about 60 dB to about 100 dB,about 70 dB to about 80 dB, about 70 dB to about 90 dB, about 70 dB toabout 100 dB, about 80 dB to about 90 dB, about 80 dB to about 100 dB,or about 90 dB to about 100 dB. In some embodiments, the electromagneticshield with a film thickness of less than 100 μm has a shieldingeffectiveness in the frequency range of about of 200 MHz to about 1 GHzof about 1 dB, about 5 dB, about 10 dB, about 20 dB, about 30 dB, about40 dB, about 50 dB, about 60 dB, about 70 dB, about 80 dB, about 90 dB,or about 100 dB. In some embodiments, the electromagnetic shield with afilm thickness of less than 100 μm has a shielding effectiveness in thefrequency range of about of 200 MHz to about 1 GHz of at least about 1dB, about 5 dB, about 10 dB, about 20 dB, about 30 dB, about 40 dB,about 50 dB, about 60 dB, about 70 dB, about 80 dB, or about 90 dB. Insome embodiments, the electromagnetic shield with a film thickness ofless than 100 μm has a shielding effectiveness in the frequency range ofabout of 200 MHz to about 1 GHz of at most about 5 dB, about 10 dB,about 20 dB, about 30 dB, about 40 dB, about 50 dB, about 60 dB, about70 dB, about 80 dB, about 90 dB, or about 100 dB.

In some embodiments, the electromagnetic shield with a film thickness ofless than 100 μm has a shielding effectiveness in the frequency range ofabout 2 GHz to about 18 GHz of about 1 dB to about 120 dB. In someembodiments, the electromagnetic shield with a film thickness of lessthan 100 μm has a shielding effectiveness in the frequency range ofabout 2 GHz to about 18 GHz of about 1 dB to about 5 dB, about 1 dB toabout 10 dB, about 1 dB to about 20 dB, about 1 dB to about 30 dB, about1 dB to about 40 dB, about 1 dB to about 50 dB, about 1 dB to about 60dB, about 1 dB to about 70 dB, about 1 dB to about 80 dB, about 1 dB toabout 100 dB, about 1 dB to about 120 dB, about 5 dB to about 10 dB,about 5 dB to about 20 dB, about 5 dB to about 30 dB, about 5 dB toabout 40 dB, about 5 dB to about 50 dB, about 5 dB to about 60 dB, about5 dB to about 70 dB, about 5 dB to about 80 dB, about 5 dB to about 100dB, about 5 dB to about 120 dB, about 10 dB to about 20 dB, about 10 dBto about 30 dB, about 10 dB to about 40 dB, about 10 dB to about 50 dB,about 10 dB to about 60 dB, about 10 dB to about 70 dB, about 10 dB toabout 80 dB, about 10 dB to about 100 dB, about 10 dB to about 120 dB,about 20 dB to about 30 dB, about 20 dB to about 40 dB, about 20 dB toabout 50 dB, about 20 dB to about 60 dB, about 20 dB to about 70 dB,about 20 dB to about 80 dB, about 20 dB to about 100 dB, about 20 dB toabout 120 dB, about 30 dB to about 40 dB, about 30 dB to about 50 dB,about 30 dB to about 60 dB, about 30 dB to about 70 dB, about 30 dB toabout 80 dB, about 30 dB to about 100 dB, about 30 dB to about 120 dB,about 40 dB to about 50 dB, about 40 dB to about 60 dB, about 40 dB toabout 70 dB, about 40 dB to about 80 dB, about 40 dB to about 100 dB,about 40 dB to about 120 dB, about 50 dB to about 60 dB, about 50 dB toabout 70 dB, about 50 dB to about 80 dB, about 50 dB to about 100 dB,about 50 dB to about 120 dB, about 60 dB to about 70 dB, about 60 dB toabout 80 dB, about 60 dB to about 100 dB, about 60 dB to about 120 dB,about 70 dB to about 80 dB, about 70 dB to about 100 dB, about 70 dB toabout 120 dB, about 80 dB to about 100 dB, about 80 dB to about 120 dB,or about 100 dB to about 120 dB. In some embodiments, theelectromagnetic shield with a film thickness of less than 100 μm has ashielding effectiveness in the frequency range of about 2 GHz to about18 GHz of about 1 dB, about 5 dB, about 10 dB, about 20 dB, about 30 dB,about 40 dB, about 50 dB, about 60 dB, about 70 dB, about 80 dB, about100 dB, or about 120 dB. In some embodiments, the electromagnetic shieldwith a film thickness of less than 100 μm has a shielding effectivenessin the frequency range of about 2 GHz to about 18 GHz of at least about1 dB, about 5 dB, about 10 dB, about 20 dB, about 30 dB, about 40 dB,about 50 dB, about 60 dB, about 70 dB, about 80 dB, or about 100 dB. Insome embodiments, the electromagnetic shield with a film thickness ofless than 100 μm has a shielding effectiveness in the frequency range ofabout 2 GHz to about 18 GHz of at most about 5 dB, about 10 dB, about 20dB, about 30 dB, about 40 dB, about 50 dB, about 60 dB, about 70 dB,about 80 dB, about 100 dB, or about 120 dB.

In some embodiments, the electromagnetic shield with a film thickness ofless than 100 μm has a shielding effectiveness in the frequency range ofabout 18 GHz to about 40 GHz of about 1 dB to about 120 dB. In someembodiments, the electromagnetic shield with a film thickness of lessthan 100 μm has a shielding effectiveness in the frequency range ofabout 18 GHz to about 40 GHz of about 1 dB to about 5 dB, about 1 dB toabout 10 dB, about 1 dB to about 20 dB, about 1 dB to about 30 dB, about1 dB to about 40 dB, about 1 dB to about 50 dB, about 1 dB to about 60dB, about 1 dB to about 70 dB, about 1 dB to about 80 dB, about 1 dB toabout 100 dB, about 1 dB to about 120 dB, about 5 dB to about 10 dB,about 5 dB to about 20 dB, about 5 dB to about 30 dB, about 5 dB toabout 40 dB, about 5 dB to about 50 dB, about 5 dB to about 60 dB, about5 dB to about 70 dB, about 5 dB to about 80 dB, about 5 dB to about 100dB, about 5 dB to about 120 dB, about 10 dB to about 20 dB, about 10 dBto about 30 dB, about 10 dB to about 40 dB, about 10 dB to about 50 dB,about 10 dB to about 60 dB, about 10 dB to about 70 dB, about 10 dB toabout 80 dB, about 10 dB to about 100 dB, about 10 dB to about 120 dB,about 20 dB to about 30 dB, about 20 dB to about 40 dB, about 20 dB toabout 50 dB, about 20 dB to about 60 dB, about 20 dB to about 70 dB,about 20 dB to about 80 dB, about 20 dB to about 100 dB, about 20 dB toabout 120 dB, about 30 dB to about 40 dB, about 30 dB to about 50 dB,about 30 dB to about 60 dB, about 30 dB to about 70 dB, about 30 dB toabout 80 dB, about 30 dB to about 100 dB, about 30 dB to about 120 dB,about 40 dB to about 50 dB, about 40 dB to about 60 dB, about 40 dB toabout 70 dB, about 40 dB to about 80 dB, about 40 dB to about 100 dB,about 40 dB to about 120 dB, about 50 dB to about 60 dB, about 50 dB toabout 70 dB, about 50 dB to about 80 dB, about 50 dB to about 100 dB,about 50 dB to about 120 dB, about 60 dB to about 70 dB, about 60 dB toabout 80 dB, about 60 dB to about 100 dB, about 60 dB to about 120 dB,about 70 dB to about 80 dB, about 70 dB to about 100 dB, about 70 dB toabout 120 dB, about 80 dB to about 100 dB, about 80 dB to about 120 dB,or about 100 dB to about 120 dB. In some embodiments, theelectromagnetic shield with a film thickness of less than 100 μm has ashielding effectiveness in the frequency range of about 18 GHz to about40 GHz of about 1 dB, about 5 dB, about 10 dB, about 20 dB, about 30 dB,about 40 dB, about 50 dB, about 60 dB, about 70 dB, about 80 dB, about100 dB, or about 120 dB. In some embodiments, the electromagnetic shieldwith a film thickness of less than 100 μm has a shielding effectivenessin the frequency range of about 18 GHz to about 40 GHz of at least about1 dB, about 5 dB, about 10 dB, about 20 dB, about 30 dB, about 40 dB,about 50 dB, about 60 dB, about 70 dB, about 80 dB, or about 100 dB. Insome embodiments, the electromagnetic shield with a film thickness ofless than 100 μm has a shielding effectiveness in the frequency range ofabout 18 GHz to about 40 GHz of at most about 5 dB, about 10 dB, about20 dB, about 30 dB, about 40 dB, about 50 dB, about 60 dB, about 70 dB,about 80 dB, about 100 dB, or about 120 dB.

Terms and Definitions

Unless otherwise defined, all technical terms used herein have the samemeaning as commonly understood by one of ordinary skill in the art towhich this disclosure belongs.

As used herein, the singular forms “a,” “an,” and “the” include pluralreferences unless the context clearly dictates otherwise. Any referenceto “or” herein is intended to encompass “and/or” unless otherwisestated.

As used herein, the term “about” refers to an amount that is near thestated amount by 10%, 5%, or 1%, including increments therein.

As used herein, the term “about” in reference to a percentage refers toan amount that is greater or less the stated percentage by 10%, 5%, or1%, including increments therein.

As used herein, the phrases “at least one”, “one or more”, and “and/or”are open-ended expressions that are both conjunctive and disjunctive inoperation. For example, each of the expressions “at least one of A, Band C”, “at least one of A, B, or C”, “one or more of A, B, and C”, “oneor more of A, B, or C” and “A, B, and/or C” means “A alone, B alone, Calone, A and B together, A and C together, B and C together, or A, B andC together”.

While preferred embodiments of the present disclosure have been shownand described herein, it will be obvious to those skilled in the artthat such embodiments are provided by way of example only. Numerousvariations, changes, and substitutions will now occur to those skilledin the art without departing from the disclosure. It should beunderstood that various alternatives to the embodiments of thedisclosure described herein may be employed in practicing thedisclosure.

EXAMPLES Example 1—EMI Shields

First, second, third, fourth, and fifth electromagnetic shieldingsamples were created per Table 1 below and tested for shieldingeffectiveness using the apparatus described herein.

TABLE 1 shielding effectiveness Shielding Sample First Second ThirdFourth Fifth Sixth Graphite (%) 85-95 80-90 80-90 0 0 30-40 C₄₅ (%) 1-51-5 1-5 0 0  0 rGO (%) 0 2-6 2-6 15-25  5-10 0.5-2   Carbon fiber (%) 01-3 1-3 1-3 0 1-6 CNT (%) 0 1-3 1-4 10-15  5-10 2-6 Binder (%) 2-6 2-62-6 60-70 85-95 85-95 Solvent Water Water Water NMP NMP PU Sheetresistance (Ω/sq) 2.5 — 1.5 28  2600   2600  Conductivity (S/m) 700 —660 300  15  15 Shielding effectiveness @ 13-23 — 12-22 10-22 10-2210-22 10 kHz to 30 kHz (dB) Shielding effectiveness @  0-48 —  0-48 0-49  0-44  0-44 40 kHz to 100 MHz (dB) Shielding effectiveness @ 20-45— 18-46  9-31 0-2 0-2 200 MHz to 1 GHz (dB) Shielding effectiveness @42-58 — 39-65 23-32 0-2 0-2 2 GHz to 18 GHz (dB) Shielding effectiveness@ 54-67 — 60-71 30-45 0-5 0-5 18 GHz to 40 GHz (dB)

FIGS. 3A-3B show microscopy images of the first EMI shield with a scaleof 20 μm and 100 μm, respectively. FIGS. 4A-4B show microscopy images ofthe third EMI shield with a scale of 50 μm and 20 μm, respectively.FIGS. 5A-5B show microscopy images of the fourth EMI shield with a scaleof 100 μm and 50 μm, respectively.

FIG. 7 shows a table of sixth to thirty-first EMI shielding samples. Asshown, therein, some samples comprise reduced graphene oxide (rGO),wherein other samples comprise graphene oxide (GO), some samplescomprise carbon nanotubes (CNT), whereas other samples comprisefunctionalized carbon nanotubes (CNT OH), some samples comprise apolyvinylidene fluoride (PVDF) binder, whereas other samples comprise abinder of carboxymethyl cellulose (CMC) and styrene butadiene rubber(SBR), some samples comprise a solvent comprising water, whereas othersamples comprise a solvent comprising N-methyl-2-pyrrolidone, somesamples comprise a substrate of glass, whereas other samples comprise asubstrate formed of polyethylene terephthalate (PET) or copper (Cu).

FIG. 8 shows a graph of shielding effectiveness in decibels verses anemitted test frequency in megahertz (MHz) for sixth to eleventh EMIfiltering samples. FIG. 9 shows a graph of shielding effectiveness indecibels verses an emitted test frequency in GHz for twelfth totwenty-first EMI filtering samples. FIG. 12 shows a graph of shieldingeffectiveness in decibels verses an emitted test frequency in GHz fortwenty-second to thirty-third EMI filtering samples. FIG. 13 shows agraph of shielding effectiveness in decibels verses an emitted testfrequency in gigahertz (GHz) for 3 EMI filtering samples of differentthicknesses. FIG. 14 shows a graph of shielding effectiveness indecibels verses an emitted test frequency in GHz for 3 EMI filteringsamples. FIG. 13 shows a graph of shielding effectiveness in decibelsverses an emitted test frequency in GHz for an exemplary filteringsample.

Example 2—First Method Forming a Coating

500-600 grams of carboxymethyl cellulose solution was mixed in with360-370 grams of a styrene butadiene rubber binder along with about 200ml of Water. 30-40 grams of C45 was added and mixed. 1350-1450 grams ofgraphite was added in the three equal portions with 100-200 mL of waterand mixed using low speed mechanical stirring (50-100 rpm). Once allgraphite powders were mixed in, 25-35 grams of carbon fiber and 25-35grams of rGO powders were added and mixed via high-shear mechanicalmixing (1000-4000 rpm). Water was added to achieve the desired rheology(2000-5000 cP) and solid content of the coating.

Example 3—Second Method Forming a Coating

300-400 grams of carboxymethyl cellulose binder aqueous solution and550-650 grams of 15% styrene butadiene rubber binder were added into themixer along with 200 ml of water and mixed via low speed mechanicalstirring (50-100 rpm). 25-35 grams of C45, 25-35 grams of carbon fiber,and 25-35 grams of rGO were ground in a powder grinder and mixed intothe binder solution via low speed stirring. A total of about 1350-1450 gof graphite was added in the three equal portions with 100-200 mL ofwater and mixed into the coating using low speed mechanical stirring.Once all powders were mixed in, the coating was mixed via high-shearmechanical mixing (1000-4000 rpm). Water was added to achieve thedesired rheology (2000-5000 cP) and solid content of the coating.

Example 4—Third Method Forming a Coating

1400-1500 grams of 15% styrene butadiene rubber binder was added intothe mixer with 200 ml of water and mixed via low speed mechanical mixing(50-100 rpm). 40-50 grams of C45, 40-50 grams g of carbon fiber, and40-50 grams g of rGO were ground in a powder grinder and mixed into thebinder solution via low speed stirring. A total of 1500-2500 grams ofgraphite was added in the three equal portions with 150-250 mL of waterand mixed into the coating using low speed mechanical stirring (50-100rpm). Once all powders were mixed in, the coating was mixed viahigh-shear mechanical mixing (1000-4000 rpm). Water was added to achievethe desired rheology (2000-5000 cP) and solid content of the coating.

Example 5—Method of Forming a Coated Film

A clearcoat and an activator, both of which were mixed using a planetarymixer. 2000-2500 grams of graphite, 50-150 grams of CNT(OH), 200-250 gof carbon fiber, and 50-60 g of Freeze-dried rGO were ground in a powdermixer. Half of the powders were transferred, in two portions, into about1500-2500 grams of polyurethane clearcoat and mixed using low speedmechanical mixing. The other half of the powders were added in 2portions into 1500-2500 grams of polyurethane activator via slowmechanical mixing. A reducer was added to adjust the rheology of theslurries. To make films, the clearcoat and the activator were combinedin a 1:1 volume ratio, hand mixed or shaken briefly and transferred intoa spray gun canister with a built-in agitator. Multiple thin coats weresprayed to achieve the desired dry film thickness.

Example 6—Method of Forming a Coating

A slurry was made using a planetary mixer typically used in lithium ionbattery industry. 1400-1600 g of 63% acrylic binder aqueous bindersolution was added into the mixer along with 370-430 ml of water andmixed via low speed mechanical stirring (50-100 rpm). About 40-50 g ofcarbon fiber, 40-50 g of carbon black, and 5-15 g of rGO were ground ina powder grinder and mixed into the binder solution via low speedstirring. A total of 2000-2300 g of graphite and 800-1000 mL of awater-based carboxylated styrene acrylic latex (48% solid) were added inthe three equal portions and mixed into the slurry using low speedmechanical stirring. Once all powders were mixed in, the slurry wasmixed via high-shear mechanical mixing (1000-4000 rpm). Water was addedto achieve the desired rheology and solid content of the slurry. Thefinal viscosity is between 1000-2000 cP. The conductivity is typicallyabout 150-180 S/m. An example of the slurry composition is provided inthe table below.

TABLE 2 Example slurry ingredient ranges Rustoleum Trinseo Cabot CB RGOTotal Water Solid 710 9501 Graphite(g) (g) PX30(g) (g) (g) (g) content1400-1600  800-1000 2000-2300 40-50 40-50 5-15 4285-5015 370-430 ~61-84%882-1008 384-480  2000-2300 40-50 40-50 5-15 3351-3901 0   100%  22-31% 9-15%  51-69%  1-2%  1-2% 0.1-1%  100.00%

Table 2 shows the respective amounts of each ingredient with the totalwet weight in the first row, the dry weight in the second row, and thepercentage of each ingredient with respect to the dry weight in thethird row.

1-15. (canceled)
 16. A method of forming an electromagnetic shield comprising: (a) forming a coating comprising: (i) a conductive additive; (ii) a binder; (iii) a solvent; (iv) a surfactant; and (v) a defoamer; (b) depositing the coating on a substrate; and (c) drying the coating on the substrate, thereby forming the electromagnetic shield.
 17. The method of claim 16, wherein the coating further comprises a viscosity modifier.
 18. The method of claim 16, wherein the forming of the coating comprises: (a) mixing the coating; (b) breaking down agglomerates in the coating; (c) removing air bubbles from the coating; or (d) any combination thereof.
 19. The method of claim 16, wherein depositing the coating on a substrate comprises depositing the coating on the substrate with a coating machine, a doctor's blade, a table-top coater, an air sprayer, or any combination thereof.
 20. The method of claim 16, wherein at least one of the breaking down of the agglomerates in the coating and the removing of the air bubbles from the coating is performed until the coating has a viscosity of about 1,000 mPa/s to about 5,000 mPa/s.
 21. The method of claim 16, wherein the conductive additive comprises a carbon-based additive.
 22. The method of claim 21, wherein the carbon-based additive comprises graphite, graphene, reduced graphene, graphene oxide, reduced graphene oxide, carbon black, cabot carbon, a carbon nanotube, a functionalized carbon nanotube, or any combination thereof.
 23. The method of claim 21, wherein the carbon-based additive comprises a carbon nanotube, or a functionalized carbon nanotube.
 24. The method of claim 23, wherein the carbon nanotube is a multiwalled carbon nanotube.
 25. The method of claim 23, wherein the functionalized carbon nanotube is functionalized with hydroxide, carboxylic acid, or both.
 26. The method of claim 23, wherein the carbon nanotube comprises an outside diameter of about 20 nm to about 60 nm.
 27. The method of claim 23, wherein the carbon nanotube comprises a specific surface area of greater than about 60 m²/g.
 28. The method of claim 23, wherein the carbon nanotube has an electrical conductivity of greater than about 100 S/cm.
 29. The method of claim 21, wherein the carbon-based additive has a mean particle size of about 2 μm to about 30 μm.
 30. The method of claim 21, wherein the carbon-based additive a specific surface area of about 2 m²/g to about 16 m²/g.
 31. The method of claim 16, wherein the solvent comprises a polar aprotic solvent comprising N-Methyl-2-pyrrolidone, or dichloromethane, tetrahydrofuran, ethyl acetate, acetone, dimethylformamide, acetonitrile, dimethyl sulfoxide, propylene carbonate, or any combination thereof.
 32. The method of claim 16, wherein the solvent comprises a polar a protic solvent comprises water, formic acid, n-butanol, isopropanol, nitromethane, ethanol, methanol, acetic acid, or any combination thereof.
 33. The method of claim 16, wherein drying the coating on the substrate comprises drying at a temperature of about 20° C. to about 120° C.
 34. The method of claim 18, further comprising breaking down agglomerates and removing air bubbles from the coating, wherein the breaking down agglomerates in the coating is performed by high shear mixing, and wherein the removing air bubbles from the coating is performed by vacuum mixing.
 35. The method of claim 16, further comprising calendaring the electromagnetic shield by a roll to roll calendaring machine. 